Підписатись
Lita Yang
Lita Yang
Stanford University
Підтверджена електронна адреса в alumni.stanford.edu
Назва
Посилання
Посилання
Рік
An Always-On 3.8 J/86% CIFAR-10 Mixed-Signal Binary CNN Processor With All Memory on Chip in 28-nm CMOS
D Bankman, L Yang, B Moons, M Verhelst, B Murmann
IEEE Journal of Solid-State Circuits 54 (1), 158-172, 2018
3582018
Pushing the limits of narrow precision inferencing at cloud scale with microsoft floating point
B Darvish Rouhani, D Lo, R Zhao, M Liu, J Fowers, K Ovtcharov, ...
Advances in neural information processing systems 33, 10271-10281, 2020
1302020
BinarEye: An always-on energy-accuracy-scalable binary CNN processor with all memory on chip in 28nm CMOS
B Moons, D Bankman, L Yang, B Murmann, M Verhelst
2018 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2018
1292018
Silicon Integrated 280 GHz Imaging Chipset With 44 SiGe Receiver Array and CMOS Source
K Sengupta, D Seo, L Yang, A Hajimiri
IEEE Transactions on Terahertz Science and Technology 5 (3), 427-437, 2015
1092015
SRAM voltage scaling for energy-efficient convolutional neural networks
L Yang, B Murmann
2017 18th International Symposium on Quality Electronic Design (ISQED), 7-12, 2017
752017
Mixed-signal circuits for embedded machine-learning applications
B Murmann, D Bankman, E Chai, D Miyashita, L Yang
2015 49th Asilomar conference on signals, systems and computers, 1341-1345, 2015
682015
Bit error tolerance of a CIFAR-10 binarized convolutional neural network processor
L Yang, D Bankman, B Moons, M Verhelst, B Murmann
2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2018
562018
Approximate SRAM for energy-efficient, privacy-preserving convolutional neural networks
L Yang, B Murmann
2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 689-694, 2017
342017
Three-dimensional stacked neural network accelerator architectures for AR/VR applications
L Yang, RM Radway, YH Chen, TF Wu, H Liu, E Ansari, V Chandra, ...
IEEE Micro 42 (6), 116-124, 2022
202022
TRIG: Hardware accelerator for inference-based applications and experimental demonstration using carbon nanotube FETs
G Hills, D Bankman, B Moons, L Yang, J Hillard, A Kahng, R Park, ...
Proceedings of the 55th Annual Design Automation Conference, 1-10, 2018
152018
Cognitive computation and communication: A complement solution to cloud for IoT
N Nguyen-Thanh, L Yang, DHN Nguyen, C Jabbour, B Murmann
2016 International Conference on Advanced Technologies for Communications …, 2016
92016
11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at< 2μm Pitch with up to 40% Energy Reduction at Iso …
TF Wu, H Liu, HE Sumbul, L Yang, D Baheti, J Coriell, W Koven, ...
2024 IEEE International Solid-State Circuits Conference (ISSCC) 67, 210-212, 2024
42024
Electrical Interconnect Energy Overhead
L Yang
Growth, 2015
22015
Characterization and Design of 3D-Stacked Memory for Image Signal Processing on AR/VR Devices
L Yang, C Kao, S Srikanth, HE Sumbul, TF Wu, H Liu, E Beigne
Proceedings of the International Symposium on Memory Systems, 38-44, 2024
12024
Low Level Radiation on Human Health
L Yang
Physics, 0
1
SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHIP WITH FACE-TO-FACE HYBRID BONDING
HE Sumbul, E Dallard, F Wu, H Liu, L Yang, MT Moreira, A Krishnan, ...
US Patent App. 18/391,011, 2025
2025
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING
H Liu, SJ Hollis, F Wu, HE Sumbul, L Yang, E Dallard
US Patent App. 18/391,018, 2025
2025
SYSTEMS AND METHODS FOR NON-UNIFORM MEMORY ACCESS ON THREE-DIMENSIONALLY-STACKED HYBRID MEMORY
L Yang, HE Sumbul, F Wu, E Dallard, H Liu, DH Morris
US Patent App. 18/391,007, 2025
2025
Overcoming Memory Limitations for On-Device AI and LLM in Wearable AR Systems
H Liu, DH Morris, L Yang, E Sumbul, TF Wu, J Gandhi, C Tamma, ...
2024 IEEE International Electron Devices Meeting (IEDM), 1-4, 2024
2024
A Quasi-Delay-Insensitive 3D Interconnect for Robustness Against Delay Uncertainties Using a 7nm Face-to-Face Wafer Bonded Process
MT Moreira, W Koven, L Yang, TF Wu, HE Sumbul, E Beigne
2024 31st IEEE International Conference on Electronics, Circuits and Systems …, 2024
2024
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