| Analysis of temperature stability and change of resonant frequency of a capacitive MEMS accelerometer XL Le, K Kim, SH Choa International Journal of Precision Engineering and Manufacturing 23 (3), 347-359, 2022 | 14 | 2022 |
| Mechanical reliability assessment of a flexible Package fabricated using laser-assisted bonding XL Le, XB Le, Y Hwangbo, J Joo, GM Choi, YS Eom, KS Choi, SH Choa Micromachines 14 (3), 601, 2023 | 4 | 2023 |
| Design of new Au–NiCo MEMS vertical probe for fine-pitch wafer-level probing XL Le, SH Choa Crystals 11 (5), 485, 2021 | 3 | 2021 |
| Enhanced polarization fatigue behavior in lead-free ferroelectric (K, Na)NbO3 thin films by Mn doping NXD Nguyen Dang Phu, Xuan Luc Le Journal of Materials Science: Materials in Electronics 35, article number 1564, 2024 | 1 | 2024 |
| Deformation Behavior of Various Interconnection Structures Using Fine Pitch Microelectromechanical Systems (MEMS) Vertical Probe X Luc Le, H Eul Lee, SH Choa Journal of Nanoscience and Nanotechnology 21 (5), 2949-2958, 2021 | 1 | 2021 |
| Omnidirectional - Wheel Conveyor Path Planning and Sorting System Using Vision Algorithms XLL Minh Dinh Bao, Nguyen Xuan Duong, Viet Dang Anh, Xiem Hoang Van 2024 International Conference on Advanced Technologies for Communications (ATC), 2024 | | 2024 |
| An Investigation of Thermal Microfluidic Device Based on Printed Circuit Board Platform XLL Nhat Pham Van, Nguyen Xuan Duong, Anh Nguyen Viet, Hai Nguyen Cong, Tuan ... Proceedings of 2024 International Conference on Mechatronic, Automobile, and …, 2024 | | 2024 |
| A STUDY OF MULTI-DIRECTION SORTING SYSTEM USING CAMERA WITH OMNI-WHEEL FOR INDUSTRIAL APPLICATIONS XLL Thanh Long Chu, Nguyen Xuan Duong, Nguyen Trung Phuc Anh, Vu Van Loc ... Proceedings of 2024 International Conference on Mechatronic, Automobile, and …, 2024 | | 2024 |
| Enhancement of ferroelectricity in perovskite BaTiO3 epitaxial thin films by sulfurization. XL Le, ND Phu, NX Duong AIMS Materials Science 11 (4), 2024 | | 2024 |
| Reliability Lifespan Prediction of MEMS Vertical Probe Using Various Interconnection Structures XL Le, DT Vuong, MY Kim, SH Choa 한국정밀공학회 학술발표대회 논문집, 360-360, 2021 | | 2021 |
| Reliability Assessment of Flexible InGaP/GaAs Double-Junction Solar Module Using Experimental and Numerical Analysis Y Kim, XL Le, SH Choa Journal of the Microelectronics and Packaging Society 26 (4), 75-82, 2019 | | 2019 |
Gwang-Mun ChoiElectronics and Telecommunications Research InstituteEmail được xác minh tại etri.re.kr