| Soft subdermal implant capable of wireless battery charging and programmable controls for applications in optogenetics CY Kim, MJ Ku, R Qazi, HJ Nam, JW Park, KS Nam, S Oh, I Kang, ... Nature communications 12 (1), 535, 2021 | 159 | 2021 |
| Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly MAN Calderon, S Oh, JR Brescia, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | 5 | 2024 |
| Reconstituted-sio2 tier with integrated copper heat spreader A Victor, M Manley, S Oh, MS Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1767-1772, 2023 | 3 | 2023 |
| Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI) E Chung, G Yan, S Oh, B Ramakrishnan, H Alissa, V Oruganti, C Belady, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 2 | 2024 |
| Opto-Myomatrix: μLED integrated microelectrode arrays for optogenetic activation and electrical recording in muscle tissue J Lu, M Zia, DA Baig, G Yan, JJ Kim, K Nagapudi, P Anschutz, S Oh, ... bioRxiv, 2024.07. 01.601601, 2024 | 1 | 2024 |
| Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications S Oh, T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | 1 | 2024 |
| Towards TSV-Compatible Microfluidic Cooling for 3D ICs G Yan, E Chung, E Masselink, S Oh, M Zia, B Ramakrishnan, V Oruganti, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Heterogeneous Integration Enabled by 3D Stitch-Chips S Oh, Z Zhang, G Yan, PK Jo, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Silicon Nitride-based CMOS-photonic Devices Using High-Q Resonators R Krishna, Z Peng, A Hosseinnia, S Oh, M Bakir, A Adibi 2024 Conference on Lasers and Electro-Optics (CLEO), 1-2, 2024 | | 2024 |