| A mechanistic thermal fatigue model for SnAgCu solder joints P Borgesen, L Wentlent, S Hamasha, S Khasawneh, S Shirazi, D Schmitz, ... Journal of Electronic Materials 47, 2526-2544, 2018 | 58 | 2018 |
| Humanoid robot-application and influence A Choudhury, H Li, C Greene, S Perumalla arXiv preprint arXiv:1812.06090, 2018 | 40 | 2018 |
| Interpreting accelerated test results for lead free solder joints P Borgesen, S Hamasha, L Wentlent, D Watson, C Greene 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-9, 2016 | 34 | 2016 |
| Evaluating patient readmission risk: a predictive analytics approach A Choudhury, CM Greene arXiv preprint arXiv:1812.11028, 2018 | 28 | 2018 |
| Prognosticating autism spectrum disorder using artificial neural network: Levenberg-Marquardt algorithm A Choudhury arXiv preprint arXiv:1812.07716, 2018 | 21 | 2018 |
| Effects of amplitude variations on deformation and damage evolution in SnAgCu solder in isothermal cycling L Wentlent, TM Alghoul, CM Greene, P Borgesen Journal of Electronic Materials 47, 2752-2760, 2018 | 21 | 2018 |
| Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling--How Wrong We Were! T Alghoul, D Watson, N Adams, S Khasawneh, F Batieha, C Greene, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1726-1732, 2016 | 19 | 2016 |
| A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes P Borgesen, L Wentlent, T Alghoul, R Sivasubramony, M Yadav, ... Microelectronics Reliability 95, 65-73, 2019 | 18 | 2019 |
| Impact of conformal coating material on the long-term reliability of ball grid array solder joints AAF Abbas, CM Greene, K Srihari, D Santos, G Pandiarajan Procedia Manufacturing 38, 1138-1142, 2019 | 17 | 2019 |
| Effects of thermal cycling on creep of SnAgCu solder joints T Alghoul, L Wentlent, R Sivasubramony, C Greene, P Thompson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (5 …, 2018 | 16 | 2018 |
| Diffusion creep of realistic SnAgCu solder joints at times and stresses of relevance to thermal fatigue T Alghoul, L Wentlent, R Sivasubramony, C Greene, P Thompson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 15 | 2019 |
| Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex R Muralidharan, A Raj, RS Sivasubramony, M Yadav, M Alhendi, ... Journal of Materials Research 34 (16), 2903-2910, 2019 | 14 | 2019 |
| Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures M Yadav, T Alghoul, S Thekkut, R Das, C Greene, P Borgesen, ... Journal of Electronic Packaging 144 (3), 031001, 2022 | 11 | 2022 |
| Enhanced voiding in Cu-Sn micro joints M Njuki, S Thekkut, R Sivasubramony, CM Greene, N Shahane, ... Materials Research Bulletin 150, 111759, 2022 | 11 | 2022 |
| Application of multi-quality parameter design in the optimization of underfilling process–a case study of a vehicle electronic module CY Huang, LC Shen, TH Wu, C Greene Soldering & Surface Mount Technology 33 (2), 128-138, 2021 | 10 | 2021 |
| Fatigue testing of copper nanoparticle-based joints and bonds RS Sivasubramony, MZ Kokash, S Thekkut, N Shahane, P Thompson, ... Journal of Electronic Packaging 144 (1), 011007, 2022 | 9 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 8 | 2020 |
| Applying data mining methodology to establish an intelligent decision system for PCBA process CY Huang, M Ruano, CH Chen, C Greene Soldering & Surface Mount Technology 31 (4), 271-278, 2019 | 7 | 2019 |
| Collaborative robot selection using analytical hierarchical process SS Mecheri, CM Greene International Journal of Rapid Manufacturing 8 (4), 326-344, 2019 | 7 | 2019 |
| Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds S Thekkut, MZ Kokash, RS Sivasubramony, Y Kawana, K Mirpuri, ... Journal of Electronic Packaging 144 (3), 031009, 2022 | 6 | 2022 |