Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps CS Selvanayagam, JH Lau, X Zhang, SKW Seah, K Vaidyanathan, ...
IEEE transactions on advanced packaging 32 (4), 720-728, 2009
412 2009 Development of 3-D silicon module with TSV for system in packaging N Khan, VS Rao, S Lim, HS We, V Lee, X Zhang, EB Liao, R Nagarajan, ...
IEEE Transactions on Components and Packaging Technologies 33 (1), 3-9, 2010
211 2010 High-density 3D-boron nitride and 3D-graphene for high-performance nano–thermal interface material M Loeblein, SH Tsang, M Pawlik, EJR Phua, H Yong, XW Zhang, CL Gan, ...
ACS nano 11 (2), 2033-2044, 2017
191 2017 Heterogeneous 2.5 D integration on through silicon interposer X Zhang, JK Lin, S Wickramanayaka, S Zhang, R Weerasekera, R Dutta, ...
Applied physics reviews 2 (2), 2015
176 2015 The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures FX Che, WH Zhu, ESW Poh, XW Zhang, XR Zhang
Journal of Alloys and Compounds 507 (1), 215-224, 2010
174 2010 Development of through silicon via (TSV) interposer technology for large die (21× 21mm) fine-pitch Cu/low-k FCBGA package X Zhang, TC Chai, JH Lau, CS Selvanayagam, K Biswas, S Liu, D Pinjala, ...
2009 59th Electronic components and technology conference, 305-312, 2009
136 2009 Study on Cu protrusion of through-silicon via FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013
115 2013 Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology FX Che, D Ho, MZ Ding, X Zhang
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015
96 2015 TSV interposer fabrication for 3D IC packaging VS Rao, HS Wee, LWS Vincent, LH Yu, L Ebin, R Nagarajan, CT Chong, ...
2009 11th Electronics Packaging Technology Conference, 431-437, 2009
88 2009 Electromigration performance of Through Silicon Via (TSV)–A modeling approach YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu
Microelectronics Reliability 50 (9-11), 1336-1340, 2010
87 2010 Enhancement of hotspot cooling with diamond heat spreader on Cu microchannel heat sink for GaN-on-Si device Y Han, BL Lau, X Zhang, YC Leong, KF Choo
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014
62 2014 Design and development of a multi-die embedded micro wafer level package V Kripesh, VS Rao, A Kumar, G Sharma, KC Houe, Z Xiaowu, KY Mong, ...
2008 58th Electronic Components and Technology Conference, 1544-1549, 2008
59 2008 Effect of TSV interposer on the thermal performance of FCBGA package YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ...
2009 11th Electronics Packaging Technology Conference, 778-786, 2009
58 2009 Development of Large Die Fine-Pitch Cu/Low- TC Chai, X Zhang, JH Lau, CS Selvanayagam, P Damaruganath, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (5 …, 2011
57 2011 Development of wafer-level warpage and stress modeling methodology and its application in process optimization for TSV wafers F Che, HY Li, X Zhang, S Gao, KH Teo
IEEE transactions on components, packaging and manufacturing technology 2 (6 …, 2012
56 2012 Modeling stress in silicon with TSVs and its effect on mobility C Selvanayagam, X Zhang, R Rajoo, D Pinjala
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011
56 2011 A novel method to predict die shift during compression molding in embedded wafer level package CH Khong, A Kumar, X Zhang, G Sharma, SR Vempati, K Vaidyanathan, ...
2009 59th Electronic Components and Technology Conference, 535-541, 2009
56 2009 Thermo-mechanical finite element analysis in a multichip build up substrate based package design X Zhang, EH Wong, C Lee, TC Chai, Y Ma, PS Teo, D Pinjala, S Sampath
Microelectronics Reliability 44 (4), 611-619, 2004
52 2004 A damage evolution model for thermal fatigue analysis of solder joints X Zhang, SWR Lee, YH Pao
J. Electron. Packag. 122 (3), 200-206, 2000
51 2000 Thermal management of hotspots using diamond heat spreader on Si microcooler for GaN devices Y Han, BL Lau, G Tang, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
48 2015