| Soft magnetic skin for super-resolution tactile sensing with force self-decoupling Y Yan, Z Hu, Z Yang, W Yuan, C Song, J Pan, Y Shen Science Robotics 6 (51), eabc8801, 2021 | 359 | 2021 |
| Surface texture recognition by deep learning‐enhanced tactile sensing Y Yan, Z Hu, Y Shen, J Pan Advanced Intelligent Systems 4 (1), 2100076, 2022 | 37 | 2022 |
| Fast localization and segmentation of tissue abnormalities by autonomous robotic palpation Y Yan, J Pan IEEE Robotics and Automation Letters 6 (2), 1707-1714, 2021 | 33 | 2021 |
| Tactile super-resolution model for soft magnetic skin Y Yan, Y Shen, C Song, J Pan IEEE Robotics and Automation Letters 7 (2), 2589-2596, 2022 | 22 | 2022 |
| Visual-tactile sensing for real-time liquid volume estimation in grasping F Zhu, R Jia, L Yang, Y Yan, Z Wang, J Pan, W Wang 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems …, 2022 | 15 | 2022 |
| Polymer-based self-calibrated optical fiber tactile sensor W Chen, Y Yan, Z Zhang, L Yang, J Pan 2023 IEEE/RSJ International Conference on Intelligent Robots and Systems …, 2023 | 5 | 2023 |
| Grains: Proximity sensing of objects in granular materials Z Zhang, R Jia, Y Yan, R Han, S Lin, Q Jiang, L Zhang, J Pan arXiv preprint arXiv:2307.05935, 2023 | 5 | 2023 |
| A finite element method of modelling and designing of an ACCC conductor Y Youcan, D Yugang MATEC Web of Conferences 153, 01005, 2018 | 4 | 2018 |
| Electromechanical sensor and a method of sensing an object or a tactile input using the sensor Y Shen, Y Yan, J Pan US Patent 11,668,554, 2023 | 2 | 2023 |
| A haptic-based proximity sensing system for buried object in granular material Z Zhang, R Jia, Y Yan, R Han, S Lin, Q Jiang, L Zhang, J Pan arXiv preprint arXiv:2411.17083, 2024 | 1 | 2024 |
| A soft skin with self-decoupled three-axis force-sensing taxels Y Yan, A Zermane, J Pan, A Kheddar Nature Machine Intelligence, 1-12, 2024 | 1 | 2024 |
| Minimal Impact Pokes to Place Objects on Planar Surfaces A Zermane, L Moussafir, Y Yan, A Kheddar IEEE Robotics and Automation Letters, 2024 | | 2024 |
Jia PanComputer Science, The University of Hong Kong在 cs.hku.hk 的电子邮件经过验证