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Tao Chen
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年份
Gallium nitride-based complementary logic integrated circuits
Z Zheng, L Zhang, W Song, S Feng, H Xu, J Sun, S Yang, T Chen, J Wei, ...
Nature electronics 4 (8), 595-603, 2021
2152021
GaN power integration technology and its future prospects
J Wei, Z Zheng, G Tang, H Xu, G Lyu, L Zhang, J Chen, M Hua, S Feng, ...
IEEE Transactions on Electron Devices, 2023
412023
RF linearity enhancement of GaN-on-Si HEMTs with a closely coupled double-channel structure
W Song, Z Zheng, T Chen, J Wei, L Yuan, KJ Chen
IEEE Electron Device Letters 42 (8), 1116-1119, 2021
372021
SiN/in-situ-GaON staggered gate stack on p-GaN for enhanced stability in buried-channel GaN p-FETs
L Zhang, Z Zheng, Y Cheng, YH Ng, S Feng, W Song, T Chen, KJ Chen
2021 IEEE International Electron Devices Meeting (IEDM), 5.3. 1-5.3. 4, 2021
282021
Threshold Voltage Instability of Enhancement-Mode GaN Buried p-Channel MOSFETs
Z Zheng, L Zhang, W Song, T Chen, S Feng, YH Ng, J Sun, H Xu, S Yang, ...
IEEE Electron Device Letters 42 (11), 1584-1587, 2021
252021
Normally-OFF p-GaN gate double-channel HEMT with suppressed hot-electron-induced dynamic on-resistance degradation
H Liao, Z Zheng, T Chen, L Zhang, Y Cheng, S Feng, YH Ng, L Chen, ...
IEEE Electron Device Letters 43 (9), 1424-1427, 2022
212022
Strain Release in GaN Epitaxy on 4° Off‐Axis 4H‐SiC
S Feng, Z Zheng, Y Cheng, YH Ng, W Song, T Chen, L Zhang, K Liu, ...
Advanced Materials 34 (23), 2201169, 2022
212022
Physics-based 2-D analytical model for field-plate engineering of AlGaN/GaN power HFET
T Chen, Q Zhou, D Wei, C Dong, W Chen, B Zhang
IEEE Transactions on Electron Devices 66 (1), 116-125, 2018
192018
Distribution and transport of holes in the p-GaN/AlGaN/GaN heterostructure
YH Ng, Z Zheng, L Zhang, R Liu, T Chen, S Feng, Q Shao, KJ Chen
Applied Physics Letters 123 (14), 2023
132023
A GaN power integration platform based on engineered bulk Si substrate with eliminated crosstalk between high-side and low-side HEMTs
G Lyu, J Wei, W Song, Z Zheng, L Zhang, J Zhang, Y Cheng, S Feng, ...
2021 IEEE International Electron Devices Meeting (IEDM), 5.2. 1-5.2. 4, 2021
132021
Unveiling the parasitic electron channel under the gate of enhancement-mode p-channel GaN field-effect transistors on the p-GaN/AlGaN/GaN platform
Z Zheng, T Chen, L Zhang, W Song, KJ Chen
Applied Physics Letters 120 (15), 2022
102022
p-GaN gate power HEMT heterostructure as a versatile platform for extremely wide-temperature-range (X-WTR) applications
YH Ng, Z Zheng, L Zhang, R Liu, T Chen, S Feng, Q Shao, KJ Chen
Applied Physics Letters 124 (4), 2024
82024
HyFET—A GaN/SiC Hybrid Field-Effect Transistor
S Feng, Z Zheng, Y Wang, G Lyu, K Liu, Y Cheng, J Chen, T Chen, ...
2023 International Electron Devices Meeting (IEDM), 1-4, 2023
82023
Gate Leakage and Reliability of GaN-Channel FET With SiNₓ/GaON Staggered Gate Stack
L Zhang, Z Zheng, W Song, T Chen, S Feng, J Chen, M Hua, KJ Chen
IEEE Electron Device Letters 43 (11), 1822-1825, 2022
82022
GaN non-volatile memory based on junction barrier-controlled bipolar charge trapping
T Chen, Z Zheng, S Feng, L Zhang, W Song, KJ Chen
IEEE Electron Device Letters 43 (5), 697-700, 2022
82022
Avalanche capability of 650-V normally-off GaN/SiC cascode power device
K Zhong, J Sun, Y Wang, G Lyu, S Feng, T Chen, KJ Chen
2021 33rd International Symposium on Power Semiconductor Devices and ICs …, 2021
82021
Endurance improvement of GaN bipolar charge trapping memory with back gate injection
T Chen, Z Zheng, S Feng, L Zhang, KJ Chen
IEEE Electron Device Letters, 2023
72023
Electroluminescence and Gate Carrier Dynamics in a Schottky-type p-GaN Gate Double-Channel GaN HEMT
S Feng, H Liao, T Chen, J Chen, Y Cheng, M Hua, Z Zheng, KJ Chen
IEEE Electron Device Letters, 2023
62023
Impact of Inadequate Mg Activation on Dynamic Threshold Voltage of Schottky-type -GaN Gate HEMTs
J Sun, Z Zheng, L Zhang, YH Ng, J Shu, T Chen, KJ Chen
2023 35th International Symposium on Power Semiconductor Devices and ICs …, 2023
62023
GaN on engineered bulk silicon power integration platform with avalanche capability enabled by built-in Si PN junctions
G Lyu, S Feng, L Zhang, T Chen, J Wei, KJ Chen
IEEE Electron Device Letters 43 (11), 1826-1829, 2022
62022
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