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Eric PopPease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLAC在 stanford.edu 的电子邮件经过验证- David EstradaBoise State University; Idaho National Laboratory在 boisestate.edu 的电子邮件经过验证
- Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of Pittsburgh在 pitt.edu 的电子邮件经过验证
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, Singapore在 ihpc.a-star.edu.sg 的电子邮件经过验证
- Zuanyi LiASML在 illinois.edu 的电子邮件经过验证
- David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Yee Kan KOHNational University of Singapore在 nus.edu.sg 的电子邮件经过验证
- Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of Korea在 khu.ac.kr 的电子邮件经过验证
- Ashkan BehnamDevice Engineer, Micron在 micron.com 的电子邮件经过验证
- Jae Cheol ShinProfessor at Division of Electrical and Electronics Engineering at Dongguk University在 dgu.ac.kr 的电子邮件经过验证
- Sharnali IslamUniversity of Dhaka在 du.ac.bd 的电子邮件经过验证
- William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University of在 illinois.edu 的电子邮件经过验证
- Albert LiaoEmerging Memory Engineer, Micron在 micron.com 的电子邮件经过验证
- Rashid BashirDean, Grainger College of Engineering, Grainger Distinguished Chair, Dept of Bioengineering,在 illinois.edu 的电子邮件经过验证
- Enrique CarrionIntel在 intel.com 的电子邮件经过验证
- Won Il ParkProfessor of Materials Science and Engineering, Hanyang University在 hanyang.ac.kr 的电子邮件经过验证
- Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern University在 northwestern.edu 的电子邮件经过验证
- Shafiqul IslamProfessor, Civil and Environmental Engineering, Water Diplomacy, Tufts University在 tufts.edu 的电子邮件经过验证
- Vincent E. DorganEngineer, Intel
