Fabrication and characteristics of black silicon for solar cell applications: An overview CH Hsu, JR Wu, YT Lu, DJ Flood, AR Barron, LC Chen Materials Science in Semiconductor Processing 25, 2-17, 2014 | 133 | 2014 |
Surface modification of highly ordered TiO2 nanotube arrays for efficient photoelectrocatalytic water splitting CJ Lin, YT Lu, CH Hsieh, SH Chien Applied Physics Letters 94 (11), 113102, 2009 | 101 | 2009 |
Fabrication of open-ended high aspect-ratio anodic TiO2 nanotube films for photocatalytic and photoelectrocatalytic applications CJ Lin, WY Yu, YT Lu, SH Chien Chemical Communications, 6031-6033, 2008 | 95 | 2008 |
Anti-reflection layers fabricated by a one-step copper-assisted chemical etching with inverted pyramidal structures intermediate between texturing and nanopore-type black silicon YT Lu, AR Barron Journal of Materials Chemistry A 2 (30), 12043-12052, 2014 | 84 | 2014 |
Nanopore-type black silicon anti-reflection layers fabricated by a one-step silver-assisted chemical etching YT Lu, AR Barron Phys. Chem. Chem. Phys. 15, 9862-9870, 2013 | 65 | 2013 |
Materials science in semiconductor processing J Lu, Z Ye, L Wang, J Huang, B Zhao | 12 | 2003 |
Low-k dielectric etch challenges at the 7 nm logic node and beyond: Continuous-wave versus quasiatomic layer plasma etching performance review KM Lutker-Lee, YT Lu, Q Lou, J Kaminsky, Y Kikuchi, A Raley Journal of Vacuum Science & Technology A 37 (1), 2019 | 9 | 2019 |
High aspect ratio via etch using atomic layer deposition protection layer YT Lu, X Sun, ECF Liu US Patent 11,121,027, 2021 | 6 | 2021 |
In-Situ Fabrication of a Self-Aligned Selective Emitter Silicon Solar Cell Using the Gold Top Contacts To Facilitate the Synthesis of a Nanostructured Black Silicon … YT Lu, AR Barron ACS Applied Materials & Interfaces 7 (22), 11802-11814, 2015 | 5 | 2015 |
Atomic layer deposition for low-K trench protection during etch YT Lu, D O'meara, A Raley, X Sun US Patent 10,964,587, 2021 | 3 | 2021 |
Fabrication of anti-reflection coating layers for silicon solar cells by liquid phase deposition YT Lu, AR Barron Main Group Chemistry 14 (4), 279-290, 2015 | 2 | 2015 |
Selective deposition of conductive cap for fully-aligned-via (FAV) YT Lu, KH Yu, X Sun, A Raley US Patent 11,515,203, 2022 | 1 | 2022 |
METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES S Chang, Y Lu, D Zhang, DL O'meara, J Shearer US Patent App. 18/337,281, 2024 | | 2024 |
Protection Layer Formation during Plasma Etching Conductive Materials YT Lu, S Chang, N Joy US Patent App. 18/312,427, 2024 | | 2024 |
Method for patterning a dielectric layer YT Lu, X Sun, S Chang, ECF Liu, A Raley, K Lutker-Lee US Patent 11,756,790, 2023 | | 2023 |
ALD (atomic layer deposition) liner for via profile control and related applications X Sun, YT Lu, A Raley, D O'meara, J Smith US Patent 11,742,241, 2023 | | 2023 |
Split ash processes for via formation to suppress damage to low-K layers YT Lu, A Raley, J Lee US Patent 11,721,578, 2023 | | 2023 |
Method for using ultra thin ruthenium metal hard mask for etching profile control YT Lu, KH Yu, A Raley US Patent 11,688,604, 2023 | | 2023 |
Radiation of substrates during processing and systems thereof M Edley, X Sun, YT Lu, A Raley, H Zhang, H Suzuki, S Hu US Patent 11,289,325, 2022 | | 2022 |
ALD (atomic layer deposition) liner for via profile control and related applications X Sun, YT Lu, A Raley, D O'meara, J Smith US Patent 11,164,781, 2021 | | 2021 |