Non-invasive fault injection attacks have emerged as significant threats to a spectrum of
microelectronic systems ranging from commodity devices to high-end customized …

The semiconductor industry is experiencing a significant shift from traditional methods of
shrinking devices and reducing costs. Chip designers actively seek new technological …

The semiconductor industry has adopted heterogeneous integration (HI), incorporating
modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to …

System-in-package (SiP) is a type of electronic packaging convention that integrates
multiple components, such as microprocessors, memory, sensors, and so on, in the form of …

Over the past few decades, electronics have become commonplace in government,
commercial, and social domains. These devices have developed rapidly, as seen in the …

As Moore's law comes to a crawl, advanced package and integration techniques become
increasingly crucial by allowing for the combination of fabricated silicon dies, so-called …

As Moore's law comes to a crawl, heterogeneous integration-based system-in-package
emerges as a promising direction to maintain the speedy rate of performance density …

Aggressive technology scaling, which has fueled the remarkable growth of the
semiconductor industry for past decades, is faced with several fundamental barriers. Under …

Due to slowdown of Moore's law and Dennard scaling, modern hardware design has shifted
to heterogenous integration (HI) instead of traditional monolithic ICs. However, HI incurs its …

During the pre-silicon stage, being able to predict the compatibility of an integrated circuit
(IC) package to X-ray based inspection can be crucial in modern semiconductor …