[HTML][HTML] A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …
environmental concerns. However, experimental testing and microstructural characterization …
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents
Purpose There are several lead-free solder alloys available in the industry. Over the years,
the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly …
the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly …
[HTML][HTML] Study of the effect of crystal orientation on the mechanical response and fatigue life of solder joints under thermal cycling by crystal plasticity
M **e, G Chen, X Yuan, L Zhang, Q Lin - Journal of Materials Research and …, 2023 - Elsevier
Electronic products are subjected to thermal cycling caused by power cycling in service
processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder …
processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder …
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
The effects of aging on the cyclic shear stress–strain and fatigue behavior of lead-free
solders have been explored experimentally and have been presented in this paper. An …
solders have been explored experimentally and have been presented in this paper. An …
The effects of aging on the fatigue life of lead free solders
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in
actual application or in accelerated life testing used for qualification. Mismatches in the …
actual application or in accelerated life testing used for qualification. Mismatches in the …
Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictions
Isothermal aging causes detrimental changes in the microstructure, mechanical response,
and failure behavior of lead free solder joints in electronic assemblies. These material …
and failure behavior of lead free solder joints in electronic assemblies. These material …
Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder
Lead free solder materials are used as interconnects in electronic assemblies due to their
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …
Mechanical characterization of doped SAC solder materials at high temperature
Reliable lead free solders are needed for products exposed to extreme environments such
as those used in the automotive, avionics, and oil-exploration industries, as well as in …
as those used in the automotive, avionics, and oil-exploration industries, as well as in …
Visualization of microstructural evolution in lead free solders during isothermal aging using time-lapse imagery
In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …
(SPM) have been utilized to examine aging induced microstructural changes occurring …