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[HTML][HTML] The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates
S Zhang, S Wang, S Zhang, X Chen, C Zeng… - Journal of Materials …, 2023 - Elsevier
The preparation of new solder joint materials for chip packaging by designing a variety of
brazing material mixes has become one of the future research directions for solder joints …
brazing material mixes has become one of the future research directions for solder joints …
Bioinspired low temperature Cu bonding interfaces with interlocked microstructures to achieve high reliability
P Cao, C Wang, L Liu, K Ding, J He, D Yan, N Lin - Surfaces and Interfaces, 2024 - Elsevier
The reliability of Cu bonding technology in three-dimensional integration packaging is
limited by high sintering temperatures and the growth of oxide at the joining interface …
limited by high sintering temperatures and the growth of oxide at the joining interface …
[HTML][HTML] Diffusion barrier properties of the intermetallic compound layers formed in the Pt nanoparticles alloyed Sn-58Bi solder joints reacted with ENIG and ENEPIG …
H Choi, CL Kim, Y Sohn - Materials, 2022 - mdpi.com
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
Reliability of micro-resistance welded dissimilar connection between Ag-plated Kovar foil and GaAs space solar cell: Processing, microstructure and bonding strength
Y Ding, Z Wang, J Ma, C Shen, K Wang, N Chen… - Materials Today …, 2024 - Elsevier
Solar panels in low earth orbit (LEO) can suffer from damage caused by atomic oxygen (AO)
exposure and thermal shock, which may shorten the service life of their interconnectors and …
exposure and thermal shock, which may shorten the service life of their interconnectors and …
Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu
YJ Li, YW Yen, CM Chen - Materials, 2024 - mdpi.com
Sn-3Ag-0.5 Cu (SAC305)-and Sn-9Zn-based alloys (Sn-Zn-X, X= Al, In) are lead-free
solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile …
solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile …
[HTML][HTML] Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention
The electromigration reliability of Au/Pd (P)/Ni (P) surface finish in micro joints was
investigated in this study. We found that the reaction of Pd (P) with molten Sn would yield a …
investigated in this study. We found that the reaction of Pd (P) with molten Sn would yield a …
Interfacial microstructure and mechanical reliability of Sn-58Bi/ENEPIG solder joints
C Chen, C Wang, H Sun, H Yin, X Gao, H Xue, D Ni… - Processes, 2022 - mdpi.com
The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to
electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the …
electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the …
First-principles study on the structural, elastic and thermodynamic properties of binary Pd-Sn compounds
Y Tian, G Jia, P Wu - Journal of Electronic Materials, 2023 - Springer
The structural, mechanical, thermodynamic and electronic properties of Pd-Sn compounds
including PdSn4, PdSn3, PdSn2, PdSn, Pd2Sn and Pd3Sn have been investigated by first …
including PdSn4, PdSn3, PdSn2, PdSn, Pd2Sn and Pd3Sn have been investigated by first …
Interfacial reactions between liquid Ga and solid Au
H Choi, Y Sohn - Materials Letters, 2023 - Elsevier
Interfacial reactions between liquid Ga and solid Au were investigated from room
temperature to 150° C. It was found that only one intermetallic phase, AuGa 2, was formed at …
temperature to 150° C. It was found that only one intermetallic phase, AuGa 2, was formed at …
Analysis of intermetallic compound formation in the reactions at liquid Ga/solid Pd interface
B Kim, Y Sohn - Surfaces and Interfaces, 2022 - Elsevier
Interfacial reactions between liquid Ga and solid Pd were investigated in two different
temperature ranges: 120–180° C and 250–350° C. In the low-temperature range (120–180° …
temperature ranges: 120–180° C and 250–350° C. In the low-temperature range (120–180° …