Materials informatics: From the atomic-level to the continuum
In recent years materials informatics, which is the application of data science to problems in
materials science and engineering, has emerged as a powerful tool for materials discovery …
materials science and engineering, has emerged as a powerful tool for materials discovery …
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
A dual-phase crystal plasticity finite-element method for modeling the uniaxial deformation behaviors of thermally aged SAC305 solder
M **e, G Chen, J Yu, Y Wu, X Liu, J Yang… - International Journal of …, 2022 - Elsevier
Because typical solder joints undergo thermal aging during use, models simulating the
behaviors of solder under mechanical stress must accurately reflect the changes in …
behaviors of solder under mechanical stress must accurately reflect the changes in …
Shear and fatigue properties of lead-free solder joints: Modeling and microstructure analysis
Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad
H Nishikawa, N Iwata - Journal of Materials Processing Technology, 2015 - Elsevier
The formation and growth of an intermetallic compound (IMC) layer at the Sn–Ag–Cu
solder/Cu interface after laser soldering and during isothermal aging were investigated to …
solder/Cu interface after laser soldering and during isothermal aging were investigated to …
Interfacial reaction of Sn‐Ag‐Cu lead‐free solder alloy on Cu: A review
LM Lee, AA Mohamad - Advances in Materials Science and …, 2013 - Wiley Online Library
This paper reviews the function and importance of Sn‐Ag‐Cu solder alloys in electronics
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
The creep behaviour of directionally solidified SAC305 (96.5 Sn-3Ag-0.5 Cu wt%) alloy has
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
One of the crucial factors in evaluating the reliability of an electronic appliance is fatigue
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …
High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications
Abstract Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
C Li, S Chen, S Cai, J Peng, X Wang… - Journal of Iron and Steel …, 2023 - Springer
The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear
mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated …
mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated …