Metal matrix nanocomposites (MMNCs) are an emerging class of metals with nanosized
reinforcements and have been investigated extensively in recent decades due to their …

The stability of solder joints is of utmost critical in electronic equipment. The integration of
packaged devices in these systems often leads to the generation of heat, which might have …

The main objective of this study is to investigate the electrical properties of Sn–3.0 Ag–0.5
Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0 Ag …

Nanocomposite solder has been recognized as an excellent strategy to improve the
reliability of solder joints. This study attempts to find the effects of ZnO nanoparticles (NP) …

An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the
microstructure of solder/copper joints at room temperature and after aging at sub-zero …

In this study, a novel composite solder, Sn-3.5 Ag-10.0 Co, was tailored for transient liquid
phase (TLP) bonding in electric vehicle power module integration. Employing a meticulous …

This study investigates the effect of minor additions of Ni, Ni 3 Sn or Ni 3 Sn 2 nanoparticles
on the microstructure and mechanical properties of Cu/solder/Cu joints. The nanocomposite …

Herein, we prove that alloying of reactive nanoparticles can improve nanoparticles/β-Sn
interfacial bonding and influence the solder alloy's melting point. Furthermore, the alloying …

The addition of Al 2 O 3 nanoparticles with 0.01, 0.03, 0.05, 0.07, and 0.1 wt% to eutectic
solder Sn–3.5 Ag was studied so as to be aware of the influence of Al 2 O 3 addition as the …

Purpose This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7
and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5 Ag–0.5 …