Dielectric barrier, etch stop, and metal cap** materials for state of the art and beyond metal interconnects
SW King - ECS Journal of Solid State Science and Technology, 2014 - iopscience.iop.org
Over the past decade, the primary focus for improving the performance of nano-electronic
metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) …
metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) …
Silicon nitride and hydrogenated silicon nitride thin films: A review of fabrication methods and applications
Silicon nitride (SiNx) and hydrogenated silicon nitride (SiNx: H) thin films enjoy widespread
scientific interest across multiple application fields. Exceptional combination of optical …
scientific interest across multiple application fields. Exceptional combination of optical …
Silicon nitride and silicon nitride-rich thin film technologies: state-of-the-art processing technologies, properties, and applications
Accelerating interest in silicon nitride thin film material system continues in both academic
and industrial communities due to its highly desirable physical, chemical, and electrical …
and industrial communities due to its highly desirable physical, chemical, and electrical …
Silicon nitride and silicon nitride-rich thin film technologies: trends in deposition techniques and related applications
This article provides an overview of the state-of-the-art chemistry and processing
technologies for silicon nitride and silicon nitride-rich films, ie, silicon nitride with C inclusion …
technologies for silicon nitride and silicon nitride-rich films, ie, silicon nitride with C inclusion …
Plasma enhanced atomic layer deposition of SiNx: H and SiO2
SW King - Journal of Vacuum Science & Technology A, 2011 - pubs.aip.org
As the nanoelectronics industry looks to transition to both three dimensional transistor and
interconnect technologies at the< 22 nm node, highly conformal dielectric coatings with …
interconnect technologies at the< 22 nm node, highly conformal dielectric coatings with …
Investigation and review of the thermal, mechanical, electrical, optical, and structural properties of atomic layer deposited high-k dielectrics: Beryllium oxide, aluminum …
Atomic layer deposited (ALD) high-dielectric-constant (high-k) materials have found
extensive applications in a variety of electronic, optical, optoelectronic, and photovoltaic …
extensive applications in a variety of electronic, optical, optoelectronic, and photovoltaic …
Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC: H thin films
Abstract Fourier Transform Infrared (FTIR) Spectroscopy has long been utilized as an
analytical technique for qualitatively determining the presence of various different chemical …
analytical technique for qualitatively determining the presence of various different chemical …
Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films
As demand for lower power and higher performance nano-electronic products increases, the
semiconductor industry must adopt insulating materials with progressively lower dielectric …
semiconductor industry must adopt insulating materials with progressively lower dielectric …
Effect of mechanical stress on the traps in silicon nitride thin films
Silicon nitride (SiN x) films were prepared by plasma enhanced chemical vapor deposition
(PECVD) and different traps were induced in the films by tuning the RF power ratio during …
(PECVD) and different traps were induced in the films by tuning the RF power ratio during …
Film property requirements for hermetic low-k a-SiOxCyNz: H dielectric barriers
SW King, D Jacob, D Vanleuven, B Colvin… - ECS Journal of Solid …, 2012 - iopscience.iop.org
Continued reduction in resistance-capacitance (RC) delays in nano-electronic Cu
interconnect structures will require new materials with increasingly lower dielectric constants …
interconnect structures will require new materials with increasingly lower dielectric constants …