Dielectric barrier, etch stop, and metal cap** materials for state of the art and beyond metal interconnects

SW King - ECS Journal of Solid State Science and Technology, 2014 - iopscience.iop.org
Over the past decade, the primary focus for improving the performance of nano-electronic
metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) …

Silicon nitride and hydrogenated silicon nitride thin films: A review of fabrication methods and applications

N Hegedüs, K Balázsi, C Balázsi - Materials, 2021 - mdpi.com
Silicon nitride (SiNx) and hydrogenated silicon nitride (SiNx: H) thin films enjoy widespread
scientific interest across multiple application fields. Exceptional combination of optical …

Silicon nitride and silicon nitride-rich thin film technologies: state-of-the-art processing technologies, properties, and applications

AE Kaloyeros, Y Pan, J Goff… - ECS Journal of Solid State …, 2020 - iopscience.iop.org
Accelerating interest in silicon nitride thin film material system continues in both academic
and industrial communities due to its highly desirable physical, chemical, and electrical …

Silicon nitride and silicon nitride-rich thin film technologies: trends in deposition techniques and related applications

AE Kaloyeros, FA Jové, J Goff… - ECS Journal of Solid State …, 2017 - iopscience.iop.org
This article provides an overview of the state-of-the-art chemistry and processing
technologies for silicon nitride and silicon nitride-rich films, ie, silicon nitride with C inclusion …

Plasma enhanced atomic layer deposition of SiNx: H and SiO2

SW King - Journal of Vacuum Science & Technology A, 2011 - pubs.aip.org
As the nanoelectronics industry looks to transition to both three dimensional transistor and
interconnect technologies at the< 22 nm node, highly conformal dielectric coatings with …

Investigation and review of the thermal, mechanical, electrical, optical, and structural properties of atomic layer deposited high-k dielectrics: Beryllium oxide, aluminum …

JT Gaskins, PE Hopkins, DR Merrill… - ECS Journal of Solid …, 2017 - iopscience.iop.org
Atomic layer deposited (ALD) high-dielectric-constant (high-k) materials have found
extensive applications in a variety of electronic, optical, optoelectronic, and photovoltaic …

Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC: H thin films

SW King, M French, J Bielefeld, WA Lanford - Journal of Non-Crystalline …, 2011 - Elsevier
Abstract Fourier Transform Infrared (FTIR) Spectroscopy has long been utilized as an
analytical technique for qualitatively determining the presence of various different chemical …

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films

SW King, J Bielefeld, G Xu, WA Lanford… - Journal of non …, 2013 - Elsevier
As demand for lower power and higher performance nano-electronic products increases, the
semiconductor industry must adopt insulating materials with progressively lower dielectric …

Effect of mechanical stress on the traps in silicon nitride thin films

H Kim, J Aziz, VD Chavan, D Kim - Current Applied Physics, 2024 - Elsevier
Silicon nitride (SiN x) films were prepared by plasma enhanced chemical vapor deposition
(PECVD) and different traps were induced in the films by tuning the RF power ratio during …

Film property requirements for hermetic low-k a-SiOxCyNz: H dielectric barriers

SW King, D Jacob, D Vanleuven, B Colvin… - ECS Journal of Solid …, 2012 - iopscience.iop.org
Continued reduction in resistance-capacitance (RC) delays in nano-electronic Cu
interconnect structures will require new materials with increasingly lower dielectric constants …