Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
TF Chen, KS Siow - Journal of alloys and Compounds, 2021 - Elsevier
This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …
A review of SiC power module packaging: Layout, material system and integration
Silicon-Carbide (SiC) devices with superior performance over traditional silicon power
devices have become the prime candidates for future high-performance power electronics …
devices have become the prime candidates for future high-performance power electronics …
Joining of silver nanomaterials at low temperatures: processes, properties, and applications
A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …
Are sintered silver joints ready for use as interconnect material in microelectronic packaging?
KS Siow - Journal of electronic materials, 2014 - Springer
Silver (Ag) has been under development for use as interconnect material for power
electronics packaging since the late 1980s. Despite its long development history, high …
electronics packaging since the late 1980s. Despite its long development history, high …
A review on die attach materials for SiC-based high-temperature power devices
Recently, high-temperature power devices have become a popular discussion topic
because of their various potential applications in the automotive, down-hole oil and gas …
because of their various potential applications in the automotive, down-hole oil and gas …
Low-temperature low-pressure die attach with hybrid silver particle paste
K Suganuma, S Sakamoto, N Kagami, D Wakuda… - Microelectronics …, 2012 - Elsevier
New types of die attach pastes comprising micron-sized Ag particles hybridized with
submicron-sized Ag particles were considered as lead-free die attach materials for SiC …
submicron-sized Ag particles were considered as lead-free die attach materials for SiC …
Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material
JG Bai, ZZ Zhang, JN Calata… - IEEE Transactions on …, 2006 - ieeexplore.ieee.org
A nanoscale silver paste containing 30-nm silver particles that can be sintered at 280degC
was made for interconnecting semiconductor devices. Sintering of the paste produced a …
was made for interconnecting semiconductor devices. Sintering of the paste produced a …
Low-temperature sintering with nano-silver paste in die-attached interconnection
Traditional materials used in chip-level interconnections are not compatible with the high-
temperature operation of wide-bandgap high-power semiconductor devices; therefore, this …
temperature operation of wide-bandgap high-power semiconductor devices; therefore, this …
Review on joint shear strength of nano-silver paste and its long-term high temperature reliability
R Khazaka, L Mendizabal, D Henry - Journal of electronic materials, 2014 - Springer
Soldering has been the main die attach technology for several decades. Recently, in order
to meet the high temperature electronic requirements (high temperature-operating SiC and …
to meet the high temperature electronic requirements (high temperature-operating SiC and …
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips
A low-temperature sintering technique enabled by a nanoscale silver paste has been
developed for attaching large-area (> 100 mm 2) semiconductor chips. This development …
developed for attaching large-area (> 100 mm 2) semiconductor chips. This development …