A survey on machine learning against hardware trojan attacks: Recent advances and challenges

Z Huang, Q Wang, Y Chen, X Jiang - IEEE Access, 2020 - ieeexplore.ieee.org
The remarkable success of machine learning (ML) in a variety of research domains has
inspired academic and industrial communities to explore its potential to address hardware …

Hardware trojans: Lessons learned after one decade of research

K **ao, D Forte, Y **, R Karri, S Bhunia… - ACM Transactions on …, 2016 - dl.acm.org
Given the increasing complexity of modern electronics and the cost of fabrication, entities
from around the globe have become more heavily involved in all phases of the electronics …

Large-scale 3D chips: Challenges and solutions for design automation, testing, and trustworthy integration

J Knechtel, O Sinanoglu, IAM Elfadel… - IPSJ Transactions on …, 2017 - jstage.jst.go.jp
Three-dimensional (3D) integration of electronic chips has been advocated by both industry
and academia for many years. It is acknowledged as one of the most promising approaches …

TREEHOUSE: A Secure Asset Management Infrastructure for Protecting 3DIC Designs

P SLPSK, S Ray, S Bhunia - IEEE Transactions on Computers, 2023 - ieeexplore.ieee.org
The push to meet growing user requirements and manufacturing challenges at lower
technology nodes have motivated chip designers to adopt non-traditional design …

Runtime hardware Trojan monitors through modeling burst mode communication using formal verification

F Khalid, SR Hasan, O Hasan, F Awwad - Integration, 2018 - Elsevier
Globalization trends in integrated circuit (IC) design using deep sub-micron (DSM)
technologies are leading to increased vulnerability against malicious intrusions. Various …

Analysis of the security vulnerabilities of 2.5-D and 3-D integrated circuits

VV Rao, A Sasan, I Savidis - 2022 23rd International …, 2022 - ieeexplore.ieee.org
The need for greater functionality on a single integrated circuit (IC) has directly resulted in
novel techniques, methodologies, and processes that increase device density. In addition to …

Hardware trojans in 3-D ICs due to NBTI effects and countermeasure

SF Mossa, SR Hasan, O Elkeelany - Integration, 2017 - Elsevier
Going vertical as in 3-D IC design, reduces the distance between vertical active silicon dies,
allowing more dies to be placed closer to each other. However, putting 2-D IC into three …

Self-triggering hardware trojan: Due to NBTI related aging in 3-D ICs

SF Mossa, SR Hasan, O Elkeelany - Integration, 2017 - Elsevier
D ICs provide more transistor density and higher performance at smaller area compared to
traditional 2-D ICs. However, elevated temperatures and longer heat dissipation paths in 3 …

A Survey of Electromagnetic Radiation Based Hardware Assurance and Reliability Monitoring Methods in Integrated Circuits

MY Vutukuru, JM Emmert, R Jha - IEEE Access, 2024 - ieeexplore.ieee.org
Electromagnetic (EM) radiation-based hardware assurance methods are gaining
prominence due to their non-invasive nature of monitoring the chip activity and the potential …

Modeling hardware trojans in 3D ICs

Z Zhang, Q Yu - … IEEE Computer Society Annual Symposium on …, 2019 - ieeexplore.ieee.org
Three-dimensional (3D) integration facilitates to integrate increasing number of transistors
into a single package. Despite of improved performance and power efficiency, the …