The miniaturization, integration, and high data throughput of electronic chips present
challenging demands on thermal management, especially concerning heat dissipation at …

Thermal resistance at a soft/hard material interface plays an undisputed role in the
development of electronic packaging, sensors, and medicine. Adhesion energy and phonon …

The enhancement of interfacial thermal conductance is critical to the efficient heat
dissipation in micro-and nano-devices. The introduction of defects is a special method to …

Interfacial adhesion and interfacial thermal resistance (ITR) are two critical factors in the
interfacial force and energy transfer, but it is difficult to simultaneously achieve the desirable …

Lightweight, flexible, and thermostable thermally conductive materials are essential for
enhancing heat dissipation efficiency in advanced electronics. The development of intrinsic …

Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical
importance to a wide variety of applications, ranging from electronic packaging and soft …

Achieving tough, fatigue-resistant adhesion and high interfacial thermal conductance (ITC)
is crucial in various applications such as electronic packaging, soft electronics, and …

Polymeric thermal management materials present several advantages that cannot be
substituted by metallic or ceramic materials, including easy processing, lightweight …

Although intense efforts have been devoted to the development of thermally conductive
epoxy resin composites, most previous works ignore the importance of the contact thermal …

Epoxy resin (EP) based composite materials, due to their advantages such as light weight,
ease of processing, and mechanical properties, have been widely applied across thermal …