The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Electronic devices generate heat during operation and require efficient thermal
management to extend the lifetime and prevent performance degradation. Featured by its …

With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …

Nanocomposites, multiphase solid materials with at least one nanoscaled component, have
been attracting ever‐increasing attention because of their unique properties. Graphene is an …

Abstract 3D copper nanowires-thermally annealed graphene aerogel (CuNWs-TAGA)
framework is firstly prepared by freeze-drying followed by thermal annealing from CuNWs …

As a material possessing extremely high thermal conductivity, graphene has been
considered as the ultimate filler for fabrication of highly thermally conductive polymer …

Electrically insulating polymer dielectrics with high energy densities and excellent thermal
conductivities are showing tremendous potential for dielectric energy storage. However, the …

Owing to the excellent mechanical properties and thermal stability, outstanding electrical
insulation and chemical resistance, as well as easy processing and low cost, epoxy resins …

With the development of electronic technologies, electronic devices become smaller, while
their power density increases dramatically. The resulting excessive heat requires excellent …

Graphene presents an extremely ultra-high thermal conductivity, well above other known
thermally conductive fillers. However, graphene tends to aggregate easily due to its strong …