Prior to any practical application, brittle material components may need to be machined to a
high degree of precision in order to avoid functional breakdown as well as to maintain …

Slicing silicon wafers for solar cells and micro-electronic applications by diamond wire
sawing has emerged as a sustainable manufacturing process with higher productivity …

Determining the brittle-to-ductile transition (BDT) threshold is crucial for develo** efficient
machining processes for brittle materials. In this study, nanoscratch tests were performed on …

This study investigates diamond scratching at a high speed comparable to that in a grinding
process on an ultraprecision grinder. Diamond tips are prepared for the study. The scratched …

A brittle material fails under fracture due to the initiation and propagation of a crack. A high
performance device will suffer catastrophic failure under brittle fracture. Nevertheless, the …

We report resolution enhancement in scanning electron microscopy (SEM) images using a
generative adversarial network. We demonstrate the veracity of this deep learning-based …

Wire sawing technology has been widely adopted for slicing of brittle-and-hard materials
including crystalline silicon, SiC and sapphire. This paper presents a literature review on the …

Single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-
LAM) technique to machine silicon (111). The μ-LAM system is used to preferentially heat …

Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals,
and optical glass, are core materials for modern microelectronic and optoelectronic devices …

Fixed diamond wire sawing has been the most common technology to cut mono-and multi-
crystalline silicon into wafers in the fields of photovoltaics and integrated circuits. The crack …