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Failure mechanisms driven reliability models for power electronics: A review
Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …
often results in to increase in operational parameters such as current density, temperature …
Highly accelerated life testing (HALT): A review from a statistical perspective
Despite its use in one form or another for at least four decades, HALT and related
techniques [eg, highly accelerated‐stress screening (HASS) and stress audits (HASA)] are …
techniques [eg, highly accelerated‐stress screening (HASS) and stress audits (HASA)] are …
Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board
The smaller size and higher integration of electronic components result in smaller gaps
between metal conducting layers in an electronic package and printed circuit board (PCB) …
between metal conducting layers in an electronic package and printed circuit board (PCB) …
Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders
YR Yoo, YS Kim - Metals and Materials International, 2010 - Springer
SnPb solders have been widely used in many fields because of their excellent solderability.
To respond to environmental and health concerns regarding SnPb solders, it is necessary to …
To respond to environmental and health concerns regarding SnPb solders, it is necessary to …
Corrosion in electronics
Electronic control units, power modules, and consumer electronics are used today in a wide
variety of varying climatic conditions. Varying external climatic conditions of temperature and …
variety of varying climatic conditions. Varying external climatic conditions of temperature and …
Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments
Electroless nickel/immersion gold (ENIG)-plated printed circuit boards (PCBs) were exposed
to typical atmospheric environments in China for prolonged periods to understand the …
to typical atmospheric environments in China for prolonged periods to understand the …
Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages
This paper reports reliability of copper-plated through-package-vias (TPVs) in glass
interposer by modeling and experimental validation using accelerated life tests. In this …
interposer by modeling and experimental validation using accelerated life tests. In this …
Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films
The electrochemical migration (ECM) behavior and mechanism of immersion silver
processing circuit board (PCB-ImAg) and hot air solder leveling circuit board (PCB-HASL) …
processing circuit board (PCB-ImAg) and hot air solder leveling circuit board (PCB-HASL) …
Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests
Abstract Wide-band-gap (WBG) devices and embedding technology offer a huge advantage
when increasing the power density of power electronics. However, the miniaturisation leads …
when increasing the power density of power electronics. However, the miniaturisation leads …
Related to Soldering
The formation of defects and imperfections in the soldering process can have many causes,
which primarily include a poorly setup technological process, inappropriate or …
which primarily include a poorly setup technological process, inappropriate or …