Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

L Zhao, J Zhang, J Zhang, H Dai… - … Journal of Extreme …, 2023 - iopscience.iop.org
Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Molecular dynamics simulation studies of properties, preparation, and performance of silicon carbide materials: a review

Z Yan, R Liu, B Liu, Y Shao, M Liu - Energies, 2023 - mdpi.com
Silicon carbide (SiC) materials are widely applied in the field of nuclear materials and
semiconductor materials due to their excellent radiation resistance, thermal conductivity …

Molecular dynamics simulations of scratching characteristics in vibration-assisted nano-scratch of single-crystal silicon

Y Chen, Z Hu, J **, L Li, Y Yu, Q Peng, X Xu - Applied Surface Science, 2021 - Elsevier
Vibration-assisted grinding improves machining quality and efficiency over conventional
grinding, whereas its atomistic mechanism remains unclear. In this study, we investigated …

Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining

C Liu, J Ke, T Yin, WS Yip, J Zhang, S To… - International Journal of …, 2024 - Elsevier
Reaction-bonded silicon carbide (RB-SiC) is an important material used in aerospace
optical systems. Due to the property mismatch between Si and SiC phases, the underlying …

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

L Zhao, J Zhang, J Zhang, A Hartmaier - Ceramics International, 2021 - Elsevier
Deformation-induced characteristics of surface layer strongly rely on loading condition-
related operating deformation modes. In the current study we reveal the mechanisms …

High effective laser assisted diamond turning of binderless tungsten carbide

K You, F Fang - Journal of Materials Processing Technology, 2022 - Elsevier
Laser assisted diamond turning is a potential approach to increase the surface finish quality
on the hard and brittle materials and to improve diamond tool life. A high effective laser …

Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation

B Meng, D Yuan, S Xu - International Journal of Mechanical Sciences, 2019 - Elsevier
To study the influence of strain rate and heat effect on the removal behavior of SiC, the
dislocation nucleation/propagation, amorphization and abrasive wear behavior are …

Molecular dynamics simulation on crystal defects of single-crystal silicon during elliptical vibration cutting

C Liu, S To, X Sheng, J Xu - International Journal of Mechanical Sciences, 2023 - Elsevier
In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures

C Liu, X Chen, J Ke, Z She, J Zhang, J **ao… - Journal of Manufacturing …, 2021 - Elsevier
Achieving nanometric surface on single-crystal silicon is important for semiconductor and
optoelectronics industries. In recent years, thermal assisted machining (hot machining) …

Effect of water film on the nano-scratching process of 4H-SiC under the constant load

Y Zhou, Y Huang, J Li, F Zhu - Tribology International, 2022 - Elsevier
The effects of water film and scratching load on tribological properties are investigated by
molecular dynamics simulation. Water film is found to reduce the average friction coefficient …