Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …

A large number of factors such as the increasingly stringent pollutant emission policies,
fossil fuel scarcity and their price volatility have increased the interest towards the partial or …

SiC devices are promising for outperforming Si counterparts in high-frequency applications
due to its superior material properties. Conventional wirebonded packaging scheme has …

The architectural design of a power module determines its application. And the efficacy of a
power module layout appears in the system performance by assisting low-inductive busbar …

This article first developed an inductance model that includes the parasitic mutual
inductance between parallel current path segments for SiC multichip power modules. Based …

In this article, a novel approach that mitigates partial discharge (PD) by neutralizing local
electric fields with the incorporation of electrets is presented. The surface charge density …

The embedding of components in Printed Circuit Board (PCB) material is an attractive
solution to improve the performance of power converters in the 1 W-100 kW range by …

The high switching speeds of Wide BandGap (WBG) devices promise further breakthroughs
in the development of power modules. However, parasitic parameters bring more adverse …

This paper investigates the power module design for better common-mode (CM) noise and
thermal performance. A high-frequency full-bridge diode rectifier is selected as a case study …

Wide band gap (WBG) power semiconductor devices have been increasingly desirable due
to their superior characteristics compared to their Si counterparts. However, their faster …