Owing to their superior electrical, thermal, and mechanical properties, solder joints are the
most widely used interconnection materials in electronic product packaging. Because the …

Electronic devices are increasingly portable, and often susceptible to damage during
handling, transportation, and service. Because of the great variety of stresses to which …

The present work offers both a complete, quantitative model and a conservative acceleration
factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range …

In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …

The ultimate life of a microelectronics component is often limited by failure of a solder joint
due to crack growth through the laminate under a contact pad (cratering), through the …

Aging effects are common in lead free solder joints within electronic assemblies that are
exposed to isothermal environments for extended periods. Such exposures lead to evolution …

Aging effects are common in lead free solder joints within electronic assemblies that are
exposed to isothermal environments for extended periods. Such exposures lead to evolution …

In the absence of manufacturing defects the ultimate life of a microelectronics assembly in
long-term vibration is likely to be limited by solder joint fatigue. So far relatively limited efforts …

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during
storage or service. This results in evolution of joint properties over time and thereby …

Sn-based solders are known for their tendency to form coarse grained microstructures. In
combination with the high elastic anisotropy of β-Sn, the overall elastic properties and their …