Diamond/GaN HEMTs: where from and where to?

JC Mendes, M Liehr, C Li - Materials, 2022 - mdpi.com
Gallium nitride is a wide bandgap semiconductor material with high electric field strength
and electron mobility that translate in a tremendous potential for radio-frequency …

Chip-level thermal management in GaN HEMT: Critical review on recent patents and inventions

MF Abdullah, MRM Hussin, MA Ismail… - Microelectronic …, 2023 - Elsevier
The technological development of GaN high electron mobility transistor (HEMT) is on the
right track to compete with Si and SiC-based power transistors for the market segment of> …

Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices

Z Cheng, F Mu, L Yates, T Suga… - ACS applied materials & …, 2020 - ACS Publications
The wide bandgap, high-breakdown electric field, and high carrier mobility makes GaN an
ideal material for high-power and high-frequency electronics applications, such as wireless …

Fabrication of GaN/diamond heterointerface and interfacial chemical bonding state for highly efficient device design

J Liang, A Kobayashi, Y Shimizu, Y Ohno… - Advanced …, 2021 - Wiley Online Library
The direct integration of gallium nitride (GaN) and diamond holds much promise for high‐
power devices. However, it is a big challenge to grow GaN on diamond due to the large …

High thermal stability and low thermal resistance of large area GaN/3C‐SiC/diamond junctions for practical device processes

R Kagawa, Z Cheng, K Kawamura, Y Ohno… - Small, 2024 - Wiley Online Library
Thermal management is critical in contemporary electronic systems, and integrating
diamond with semiconductors offers the most promising solution to improve heat dissipation …

Development of polycrystalline diamond compatible with the latest N-polar GaN mm-wave technology

M Malakoutian, C Ren, K Woo, H Li… - Crystal Growth & …, 2021 - ACS Publications
Integration of diamond on GaN can ease the challenges associated with thermal
management of GaN-based power amplifiers which need to base on highly scaled …

Interfacial engineering for the enhancement of interfacial thermal conductance in GaN/AlN heterostructure

Q Wang, X Wang, X Liu, J Zhang - Journal of Applied Physics, 2021 - pubs.aip.org
Effective heat dissipation is the bottleneck problem for the development and
commercialization of GaN-based high-power electronic and photonic devices. To address …

Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review

T Zhan, M Xu, Z Cao, C Zheng, H Kurita, F Narita… - Micromachines, 2023 - mdpi.com
Wide-bandgap gallium nitride (GaN)-based semiconductors offer significant advantages
over traditional Si-based semiconductors in terms of high-power and high-frequency …

Integration of GaN and diamond using epitaxial lateral overgrowth

R Ahmed, A Siddique, J Anderson… - … applied materials & …, 2020 - ACS Publications
Growth of single-crystalline GaN on polycrystalline diamond is reported for the first time. The
structure was achieved using a combined process including selective diamond growth on …

A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

F Mu, B Xu, X Wang, R Gao, S Huang, K Wei… - Journal of Alloys and …, 2022 - Elsevier
To achieve high device performance and high reliability for the gallium nitride (GaN)-based
high electron mobility transistors (HEMTs), efficient heat dissipation is important but remains …