Progress in the copper-based diamond composites for thermal conductivity applications
K Chen, X Leng, R Zhao, Y Kang, H Chen - Crystals, 2023 - mdpi.com
Copper-based diamond composites have been the focus of many investigations for higher
thermal conductivity applications. However, the natural non-wetting behavior between …
thermal conductivity applications. However, the natural non-wetting behavior between …
Interface formation evolution of the hot-forged copper-(Cr) diamond composite and its thermal conductivity
Due to the distinction of (111) and (100) faces on the diamond particle, the preferential
formation of interface layers on the diamond particle is discovered when adding metal …
formation of interface layers on the diamond particle is discovered when adding metal …
A review on layerless 3D printing: challenges and applications
Purpose This paper aims to provide a full introduction, new classification, comparison and
investigation of the challenges as well as applications of layerless 3D printing, which is one …
investigation of the challenges as well as applications of layerless 3D printing, which is one …
[HTML][HTML] First efforts on recovery of thermoplastic composites at low temperatures by power ultrasonics
Fiber reinforced composites possess exceptional mass-specific properties and therefore
offer a high potential for weight reduction in lightweight applications. However, the need to …
offer a high potential for weight reduction in lightweight applications. However, the need to …
[HTML][HTML] Cr–Diamond/Cu Composites with High Thermal Conductivity Fabricated by Vacuum Hot Pressing
Q Xu, X Cao, Y Liu, Y Xu, J Wu - Materials, 2024 - mdpi.com
Chromium-plated diamond/copper composite materials, with Cr layer thicknesses of 150 nm
and 200 nm, were synthesized using a vacuum hot-press sintering process. Comparative …
and 200 nm, were synthesized using a vacuum hot-press sintering process. Comparative …
Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing
Z Ye, Z Su, K Zhao, X Wang, W Cao, B Dai, N Yan… - Materials Letters, 2023 - Elsevier
Diamond/copper composites exhibit excellent thermophysical properties and demonstrate
wide potential for heat dissipation applications. However, due to high hardness, it's difficult …
wide potential for heat dissipation applications. However, due to high hardness, it's difficult …
[HTML][HTML] Microstructure and interface evolution of diamond/Cu composites prepared via ultrasonic additive manufacturing (UAM)
B Wang, F Yang, H Zhang, P He - Journal of Materials Research and …, 2023 - Elsevier
Diamond-copper laminated composites with Cr-coating were prepared by ultrasonic additive
manufacturing method. The microstructure and interfacial configuration between Cr …
manufacturing method. The microstructure and interfacial configuration between Cr …
The Microstructures of TiC–Ti5Si3-Reinforced Cu Matrix Composites Prepared by Ti–SiC Reaction
C Zhang, X Zhang, W Miao, J Wu, F Qi, J Zhou, H Ding - Metals, 2023 - mdpi.com
In this work, the TiC and Ti5Si3-reinforced Cu matrix composites with different contents were
successfully prepared through Ti–SiC reaction in Cu melts; accordingly, the microstructures …
successfully prepared through Ti–SiC reaction in Cu melts; accordingly, the microstructures …
Effect of Hot-Pressing Pressure on the Microstructure and Thermal Conductivity of Copper/Ti-Coated Diamond Composites
Copper/diamond composites show promise as potential thermal management materials for
electronic devices due to their excellent thermophysical properties. In this study …
electronic devices due to their excellent thermophysical properties. In this study …
金刚石/铜复合材料制备方法, 界面改性及其第一性原理计算研究进展
王邦**， **滨， 郭圣达， 吴诗桂， 杨博， 张建波， 叶莹 - 粉末冶金技术 - pmt.ustb.edu.cn
金刚石/铜复合材料具有优异的导热性能, 并且其热膨胀系数可调控, 有望成为新一代热管理材料,
用于解决目前电子产品散热需求逐渐变高的问题. 然而金刚石与铜之间的润湿性较差 …
用于解决目前电子产品散热需求逐渐变高的问题. 然而金刚石与铜之间的润湿性较差 …