A comprehensive review on surface modifications of polymer‐based 3D‐printed structures: Metal coating prospects and challenges
The production of complex structures out of a variety of materials has undergone a
revolution due to the rapid development of additive manufacturing (AM) technology. Initially …
revolution due to the rapid development of additive manufacturing (AM) technology. Initially …
Liquid metal-based on cotton/lycra elastic fabric surface for flexible antenna and wearable strain sensor
J Wang, J Zhuang, W **, Q Yu, J Yu, L He, Q Wang… - Cellulose, 2023 - Springer
Textile-based wearable electronics have drawn increasing attention in recent years, but
stable and durable conductive mechanism on textiles has been the challenge. In this study …
stable and durable conductive mechanism on textiles has been the challenge. In this study …
Assessment of 3D-printed waveguides using conductive filaments and a chloroform-based smoothing process
This article presents the assessment of four different 3D-printed rectangular waveguide
structures using highly conductive filaments, operating from 8 GHz to 40 GHz. The …
structures using highly conductive filaments, operating from 8 GHz to 40 GHz. The …
Low-cost additive manufacturing techniques applied to the design of planar microwave circuits by fused deposition modeling
H García-Martínez, E Ávila-Navarro… - Polymers, 2020 - mdpi.com
This work presents a study on the implementation and manufacturing of low-cost microwave
electronic circuits, made with additive manufacturing techniques using fused deposition …
electronic circuits, made with additive manufacturing techniques using fused deposition …
[HTML][HTML] Investigating enhanced electrical conductivity for antenna applications through dual metallization on 3D printed SLA substrates
The advancement of 3D printing (additive manufacturing) has gained interest in variety of
applications, especially for antenna fabrication. The demand for cheap, reliable, and high …
applications, especially for antenna fabrication. The demand for cheap, reliable, and high …
Low-cost microwave components' fabrication in hybrid technology of laminates and additive manufacturing on an example of miniaturized suspended directional …
A low-cost approach for the fabrication of low-loss microwave components in hybrid
technology of laminates and additive manufacturing is presented in this paper. A standard …
technology of laminates and additive manufacturing is presented in this paper. A standard …
Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
C Chen, M Sun, Z Cheng, Y Liang - Materials, 2022 - mdpi.com
In order to present the multiple reflow process during electronic packaging, the influence of
the different short-time reheating temperatures on the microstructure and shear strength of …
the different short-time reheating temperatures on the microstructure and shear strength of …
A Broadband Inline Transition From On-PCB Microstrip to Hybrid Stack-Up Integrated Additively Fabricated Air-Filled Waveguide
A novel type of a highly integrated low-loss stack-up is explored that leverages additive
manufacturing for the integration of a 3D printed and metal-coated air-filled waveguide with …
manufacturing for the integration of a 3D printed and metal-coated air-filled waveguide with …
[PDF][PDF] Non-Conformal Design and Fabrications of Single Arm Conical Log Spiral Antenna
For a conical log spiral antenna (CLSA), it is quite common to place the strip conductor
conformally to the conical surface, and the antenna requires an extra impedance matching …
conformally to the conical surface, and the antenna requires an extra impedance matching …
Conformally printed additively manufactured RF demonstrator for circuit compaction
A Luce, C Areias, S Trulli, E Harper… - Flexible and Printed …, 2024 - iopscience.iop.org
Recently, there has been interest in applying additive manufacturing (AM) to radio frequency
(RF) and microwave applications, especially in packaging of microelectronic devices …
(RF) and microwave applications, especially in packaging of microelectronic devices …