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Semi-Supervised Deep Kernel Active Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization
The material removal rate (MRR) is an important variable but difficult to measure in the
chemical–mechanical planarization (CMP) process. Most data-based virtual metrology (VM) …
chemical–mechanical planarization (CMP) process. Most data-based virtual metrology (VM) …
Prognostics and health management of wafer chemical-mechanical polishing system using autoencoder
The Prognostics and Health Management Data Challenge (PHM) 2016 tracks the health
state of components of a semiconductor wafer polishing process. The ultimate goal is to …
state of components of a semiconductor wafer polishing process. The ultimate goal is to …
Removal Rate Prediction of Multiway Material Data Using the Deep Learning Approach
H Li, W Fan - Proceedings of the 8th International Conference on …, 2022 - dl.acm.org
Chemical Mechanical Polishing (CMP) process is one of the most critical process steps in
advanced packaging manufacturing. The material removal rate (MRR) value, which affects …
advanced packaging manufacturing. The material removal rate (MRR) value, which affects …
Enhancing Material Removal Rate Prediction on Wafer Surface: A PSO-DBN-OSELM Approach
T Zhan, L Liu, R Liu, E Huang, Z He… - 2023 2nd …, 2023 - ieeexplore.ieee.org
Aiming at the problem of insufficient pre-precision of wafer surface Material Removal Rate
(MRR) in chemical mechanical polishing, this paper proposes a combined model based on …
(MRR) in chemical mechanical polishing, this paper proposes a combined model based on …