High-density integration and packaging technologies are highly desired to integrate more
functionality into a smaller form factor with improved performance, in which the polymer …

In this paper, the research advances on epoxy-based nanocomposites as adhesive
materials are reported. The research and development of nanocomposite as an adhesive …

Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …

The surge in the number of distributed microelectronics and sensors requires versatile,
scalable, and affordable power sources. Heat‐harvesting organic thermoelectric generators …

The field of tissue engineering and regenerative medicine is rapidly advancing, with
numerous novel and intriguing biomimetic materials being reported. Hydrogels, due to their …

Recently, the silica particles filled epoxy-based composites underfill has gained more and
more attentions with the development of flip chip technology towards high density and fine …

The phase-transformation-induced damage of Cu 6 Sn 5 is an emerging reliability issue in
the manufacturing of 3D ICs. Although the retarded phase transformation from η-Cu 6 Sn 5 …

High-definition and arbitrary grayscale hydrogel paintings that can appear reversibly with
hydration/dehydration are realized through spatially grayscale exposure. Spatio-temporally …

Graphene oxide (GO) reinforced Polyvinyl chloride (PVC)-Waterborne Castor Alkyd (WCA)
nanocomposites (PVC/WCA/GO) films were processed through solution blending technique …

How to solve the challenge of balancing the lower coefficient of thermal expansion (CTE),
good toughness, and suitable modulus is a thorny problem in SiO2/epoxy (EP) composites …