Conductive inks have gathered increasing attention in the fabrication of next-generation
electronic devices because of their prominent compatibility and producibility. Recently …

Recently, nanosilver pastes have emerged as one of the most promising high temperature
bonding materials for high frequency and high power applications, which provide an …

Submicron Cu particles mixed with Cu complex are used successfully to fabricate highly
conductive Cu films for printed electronics. This study investigates the effects of Cu particle …

Investigations about how to improve the properties of high entropy alloys (HEAs) play a key
role in growing their potential for use in future industrial applications. Accordingly, this study …

Due to the harsh working environments up to 600° C, the exploration of high-temperature
interconnection materials is significantly important for high-power devices. In this study, a …

Sintered nano-silver die-attach materials have been widely used in high-power electronics
packaging because of their high thermal and electrical conductivities. In this study, we …

To meet the requirement of bonding power chips in microelectronic packaging, low
temperature sintering silver (Ag) nanopaste appears to be the most interesting choice in …

Nanosilver solder paste has become one of the widely materials in the field of electronic
packaging due to its excellent thermal conductivity and mechanical properties. This paper …

Develo** a joining technology for 2G HTS tapes without significantly reducing their
superconducting property is crucial for numerous applications (MRI, motor/generator, power …

Flash sintering is a powerful tool for the ultrarapid consolidation of green ceramic compacts,
although its activation mechanisms in electrically conductive PTC (Positive Temperature …