Metal silicides in CMOS technology: Past, present, and future trends
Metal silicides have played an indispensable role in the raped development of
microelectronics since PtSi was first used to improve the rectifying characteristics of diodes …
microelectronics since PtSi was first used to improve the rectifying characteristics of diodes …
Kinetics of formation of silicides: A review
FM d'Heurle, P Gas - Journal of materials research, 1986 - cambridge.org
The kinetics of silicide growth are classified into three different categories:(a) diffusion
controlled,(b) nucleation controlled,(c) others (reaction rate controlled). These are analyzed …
controlled,(b) nucleation controlled,(c) others (reaction rate controlled). These are analyzed …
Towards implementation of a nickel silicide process for CMOS technologies
C Lavoie, FM d'Heurle, C Detavernier… - Microelectronic …, 2003 - Elsevier
In this paper, we review some of the advantages and disadvantages of nickel silicide as a
material for the electrical contacts to the source, drain and gate of current and future CMOS …
material for the electrical contacts to the source, drain and gate of current and future CMOS …
Formation of thin films of NiSi: Metastable structure, diffusion mechanisms in intermetallic compounds
F d'Heurle, CS Petersson, JEE Baglin… - Journal of applied …, 1984 - pubs.aip.org
If one excepts the silicides of platinum, which are used to a considerable extent in the
present technology of silicon devices, and have therefore received much attention, no …
present technology of silicon devices, and have therefore received much attention, no …
Self-healing thermal barrier coating systems fabricated by spark plasma sintering
The present paper focuses on the Spark Plasma Sintering (SPS) manufacturing of a new
type of self-healing thermal barrier coating (TBC) and a study of its thermal cycling …
type of self-healing thermal barrier coating (TBC) and a study of its thermal cycling …
[BOOK][B] Growth kinetics of chemical compound layers
VI Dybkov - 1998 - books.google.com
The author proposes a physico-chemical approach to examining the process of solid state
growth of layers of chemical compounds at the interface between initial substances in binary …
growth of layers of chemical compounds at the interface between initial substances in binary …
Diffusion in intermetallic compounds with the CaF2 structure: A marker study of the formation of NiSi2 thin films
F d'Heurle, S Petersson, L Stolt, B Strizker - Journal of applied physics, 1982 - pubs.aip.org
In spite of a quite abundant literature about the silicides of nickel in thin film form (even an
incomplete list of publication includes some thirteen articles), 1-13 there remain significant …
incomplete list of publication includes some thirteen articles), 1-13 there remain significant …
Reaction diffusion and solid state chemical kinetics
VI Dybkov - 2010 - torrossa.com
The monograph deals with a physico-chemical approach to the problem of solid-state
growth of chemical compound layers and reaction diffusion in binary heterogeneous …
growth of chemical compound layers and reaction diffusion in binary heterogeneous …
New insights on Ni-Si system for microelectronics applications
Metal silicides and their nanostructures have been found to be suitable candidates for
device manufacturing in contemporary microelectronics industries to reduce contact …
device manufacturing in contemporary microelectronics industries to reduce contact …
In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines
V Teodorescu, L Nistor, H Bender, A Steegen… - Journal of applied …, 2001 - pubs.aip.org
Metal silicide thin films grown in a controlled manner on silicon wafers play an important role
in device fabrication for the microelectronic industry. Due to their low resistivity they are …
in device fabrication for the microelectronic industry. Due to their low resistivity they are …