Abstract Two-dimensional (2D) materials are considered for numerous applications in
microelectronics, although several challenges remain when integrating them into functional …

In this paper, novel application possibilities of CuO nanoparticles were investigated in
SAC0307 solder alloy for composite soldering purposes. CuO nanoparticles in 0.25 and 0.5 …

The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as
an alternative to lead-free surface finish in electronic industry for the reduction of metal cost …

Rapid development of additive manufacturing and new composites materials with unique
properties are promising tools for fabricating structural electronics. However, according to …

Many leading solder paste manufacturers are currently develo** solder alloys for high
reliability applications. These solder alloys are doped with elements such as bismuth (Bi) …

Intermetallic compound (IMC), as an inevitable part between pad and solder, has a severe
effect on the strength and reliability of microelectronic interconnection. Here, an investigation …

During vapour phase soldering, the lateral size of the specimen tray determines the number
of assemblies that can be soldered at once. Our research aimed to find out how we can …

Transient liquid phase bonding offers one option to generate a robust lead-free die attach
with sound thermal and electrical conductivity in microelectronic packages. However, it is a …

Solder interconnections undergo thermomechanical stress when exposed to temperature
changes. This leads to the evolution of the microstructure and the degradation of mechanical …

As electronic devices develop towards higher power consumption, pure indium is emerging
as an ideal metal thermal interface material (TIM) for flip chip ball grid array (FCBGA) …