This paper aims to examine the thermomechanical response of sintered silver die
attachments in power electronics using finite element analysis (FEA). In this work, several …

Finite element analysis (FEA) is perhaps the most popular technique used for simulating the
thermally induced failures of sintered silver die attachments in power electronics. The …

Bonding strength of sintered nano silver (Ag) joints has been an important index for
evaluating the reliability of power module packages, which has been reported to be …

Thermomechanical stress caused by the coefficient of thermal expansion (CTE) mismatch
leads to the formation of cracks, delamination, and warpage in the sintered nano-silver (S …

Bondline thickness effect on fracture behaviors and cohesive zone model (CZM) is an
important topic for adhesive joints. In this paper, the fracture and CZM of sintered nano silver …

Enhancement of the fracture resistance for sintered silver joints has been one of the critical
issues that considered frequently in engineering practice. In this paper, different …

Power electronics packages typically comprise a dielectric substrate bonded to a metal layer
and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers …

With the potential to improve upon silicon (Si) based power electronics exhausted, the push
for improvement now lies with wide bandgap (WBG) materials like gallium nitride (GaN) …

The need for reliable bonded interface materials is critical to realize the performance
benefits of wide-bandgap devices in power electronics modules, especially in operating …

With the increase in electronics devices densification, Sintered Silver (S-Ag) has gained
considerable popularity due to its exceptional thermal conductivity, enhanced electrical …