GaN-based power devices: Physics, reliability, and perspectives

M Meneghini, C De Santi, I Abid, M Buffolo… - Journal of Applied …, 2021 - pubs.aip.org
Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the
fabrication of power devices. Among the semiconductors for which power devices are …

Mechanisms of gate lag in GaN/AlGaN/GaN high electron mobility transistors

O Mitrofanov, M Manfra - Superlattices and Microstructures, 2003 - Elsevier
The presence of electronic traps in GaN-based transistors limits device performance and
reliability. It is believed that material defects and electronic states on GaN surface act as the …

Deep-level characterization in GaN HEMTs-Part I: Advantages and limitations of drain current transient measurements

D Bisi, M Meneghini, C De Santi, A Chini… - … on electron devices, 2013 - ieeexplore.ieee.org
This paper critically investigates the advantages and limitations of the current-transient
methods used for the study of the deep levels in GaN-based high-electron mobility …

Surface passivation of light emitting diodes: From nano-size to conventional mesa-etched devices

TY Seong, H Amano - Surfaces and Interfaces, 2020 - Elsevier
III-V compound semiconductor-based light emitting devices (LEDs) operating in ultraviolet to
visible wavelength ranges are greatly important for their applications, including displays …

Effects of nitrogen deficiency on electronic properties of AlGaN surfaces subjected to thermal and plasma processes

T Hashizume, H Hasegawa - Applied surface science, 2004 - Elsevier
Effects of device processing on chemical and electronic properties of AlGaN surfaces were
investigated. The X-ray photoelectron spectroscopy analysis showed serious deterioration …

On the impact of the beveled mesa for GaN-based micro-light emitting diodes: electrical and optical properties

S Hang, G Zhang, C Chu, Y Zhang, Q Zheng, Q Li… - Optics …, 2022 - opg.optica.org
In this report, the impact of different mesa designs on the optical and electrical
characteristics for GaN-based micro-light emitting diodes (µLEDs) has been systematically …

Enhanced Performance of Low-Leakage-Current Normally off p-GaN Gate HEMTs Using NH3 Plasma Pretreatment

N Wu, L Luo, Z **ng, S Li, F Zeng… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
In this article, a low-leakage-current and high-breakdown-voltage normally OFF p-GaN gate
high-electron-mobility transistor (HEMT) on a Si substrate with low-damage NH3 plasma …

Reduction of plasma-induced damage in n-type GaN by multistep-bias etching in inductively coupled plasma reactive ion etching

S Yamada, M Omori, H Sakurai, Y Osada… - Applied Physics …, 2019 - iopscience.iop.org
Plasma-induced damage was reduced by multistep-bias etching that involved a stepwise
decrease of the etching bias power (P bias) and subsequent annealing. The depth of …

Formation of highly vertical trenches with rounded corners via inductively coupled plasma reactive ion etching for vertical GaN power devices

S Yamada, H Sakurai, Y Osada, K Furuta… - Applied Physics …, 2021 - pubs.aip.org
A trench-gate metal-oxide-semiconductor field-effect transistor (T-MOSFET) has great
potential for use in gallium nitride (GaN)-based vertical power switching devices owing to its …

Sidewall dominated characteristics on fin-gate AlGaN/GaN MOS-channel-HEMTs

S Takashima, Z Li, TP Chow - IEEE transactions on electron …, 2013 - ieeexplore.ieee.org
The fin-gate structure was fabricated onto AlGaN/GaN MOS channel-high electron mobility
transistors (MOSC-HEMTs), and the fin sidewall contribution to the MOS channel …