A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
The electronics packaging community strongly believes that Moore's law will continue for
another few years due to recent technological efforts to build heterogeneously integrated …
another few years due to recent technological efforts to build heterogeneously integrated …
A study of tapered 3-D TSVs for power and thermal integrity
3-D integration presents a path to higher performance, greater density, increased
functionality and heterogeneous technology implementation. However, 3-D integration …
functionality and heterogeneous technology implementation. However, 3-D integration …
Compact lateral thermal resistance model of TSVs for fast finite-difference based thermal analysis of 3-D stacked ICs
Thermal issue is the leading design constraint for 3-D stacked integrated circuits (ICs) and
through silicon vias (TSVs) are used to effectively reduce the temperature of 3-D ICs …
through silicon vias (TSVs) are used to effectively reduce the temperature of 3-D ICs …
A universal high-efficiency cooling structure for high-power integrated circuits☆
H Wang, Q Wu, C Wang, R Wang - Applied Thermal Engineering, 2022 - Elsevier
Nowadays, the growing number of electronic components in integrated circuit (IC) chips
require higher cooling efficiency. Here we propose a universal efficient cooling structure …
require higher cooling efficiency. Here we propose a universal efficient cooling structure …
Scaling Limits, Challenges, and Opportunities in Embedded Cooling
Many packaging experts believe Moore's law will hold for another decade due to recent
technological efforts to merge multiple integrated circuit dies horizontally and vertically into a …
technological efforts to merge multiple integrated circuit dies horizontally and vertically into a …
Electrical–thermal characterization of through packaging vias in glass interposer
L Qian, Y **a, G Shi, J Wang, Y Ye… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Low-cost thin glass is developed as a promising material to advanced interposers for high
density electrical interconnection in 2.5-D and three-dimensional (3-D) integration. In this …
density electrical interconnection in 2.5-D and three-dimensional (3-D) integration. In this …
A predictive model for IC self-heating based on effective medium and image charge theories and its implications for interconnect and transistor reliability
Spatially resolved precise prediction of local temperature T (x, y, z) is essential to evaluate
Arrhenius-activated interconnect (eg, electromigration) and transistor reliability (eg, NBTI …
Arrhenius-activated interconnect (eg, electromigration) and transistor reliability (eg, NBTI …
ELOFS: An Extensible Low-Overhead Flash File System for Resource-Scarce Embedded Devices
Emerging applications like machine learning in embedded devices (eg, satellites and
vehicles) require huge storage space, which recently stimulates the widespread deployment …
vehicles) require huge storage space, which recently stimulates the widespread deployment …
Thermal-aware modeling and analysis for a power distribution network including through-silicon-vias in 3-D ICs
W Zhu, G Dong, Y Yang - IEEE Transactions on Computer …, 2018 - ieeexplore.ieee.org
The high-power dissipation and the low-heat conduction between stacked chips in 3-D
structures lead to a high temperature, which has become a critical design constraint for high …
structures lead to a high temperature, which has become a critical design constraint for high …
Nanoparticle optimization for enhanced targeted anticancer drug delivery
Nanoparticle (NP)-based drug delivery is a promising method to increase the therapeutic
index of anticancer agents with low median toxic dose. The delivery efficiency …
index of anticancer agents with low median toxic dose. The delivery efficiency …