Reversible electrodeposition of metals at liquid‐solid interfaces is a requirement for long
cycle life in rechargeable batteries that utilize metals as anodes. The process has been …

Mg batteries are an attractive alternative to Li-based energy storage due to the possibility of
higher volumetric capacities with the added advantage of using sustainable materials. A …

Achieving void-defect copper filling by electrodeposition on microvias is essentially
important. Rhodamine B (RhB) is of excellent suppressing ability based on electrochemical …

Polyethylene glycol (PEG) is a typical suppressor in the presence of chloride anions for Cu
interconnect electroplating in the field of microelectronics manufacture, yet its adsorption …

High density interconnection printed circuit board PCB puts forward high requirements for
defect free blind holes copper filling. Here, 5-amino-1, 3, 4-thiadiazole-2-mercaptan, a small …

Three fundamental types of suppressor additives for copper electroplating could be
identified by means of potential transient measurements. These suppressor additives differ …

Influences of forced convection during acid copper electroplating on microvia fill of printed
circuit boards were studied. The plating formula was composed of polyethylene glycol …

The influence of the molecular weight (Mw) of polyethylene glycol (PEG) on the microvia
filling by copper electroplating was demonstrated and examined by cross-sectional images …

Electrochemical deposition of a metal onto a foreign substrate usually occurs by an island
growth mechanism. A key feature of island growth for a material M on a foreign substrate S is …

Copper electrodeposition on copper from still plating solutions of different compositions was
investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry …