Conformality in atomic layer deposition: Current status overview of analysis and modelling
Atomic layer deposition (ALD) relies on alternated, self-limiting reactions between gaseous
reactants and an exposed solid surface to deposit highly conformal coatings with a thickness …
reactants and an exposed solid surface to deposit highly conformal coatings with a thickness …
A review on the mainstream through-silicon via etching methods
H Guo, S Cao, L Li, X Zhang - Materials Science in Semiconductor …, 2022 - Elsevier
Currently, 3D integration is considered to be the most promising development direction
forchip industry. It relies on the through-silicon via (TSV) structure to achieve mechanical …
forchip industry. It relies on the through-silicon via (TSV) structure to achieve mechanical …
Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?
K Ishikawa, K Karahashi, T Ishijima… - Japanese Journal of …, 2018 - iopscience.iop.org
In this review, we discuss the progress of emerging dry processes for nanoscale fabrication
of high-aspect-ratio features, including emerging design technology for manufacturability …
of high-aspect-ratio features, including emerging design technology for manufacturability …
[HTML][HTML] Review of nanostructured devices for thermoelectric applications
G Pennelli - Beilstein journal of nanotechnology, 2014 - beilstein-journals.org
A big research effort is currently dedicated to the development of thermoelectric devices
capable of a direct thermal-to-electrical energy conversion, aiming at efficiencies as high as …
capable of a direct thermal-to-electrical energy conversion, aiming at efficiencies as high as …
Reduced etch lag and high aspect ratios by deep reactive ion etching (DRIE)
Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used
to manufacture micron-sized structures for MEMS and microfluidic applications in silicon …
to manufacture micron-sized structures for MEMS and microfluidic applications in silicon …
Ultra deep reactive ion etching of high aspect-ratio and thick silicon using a ramped-parameter process
This paper reports an advanced deep reactive ion etching (DRIE) process for realizing ultra-
deep (500-μm) and ultra-high aspect-ratio (UHAR) silicon structures (AR 40 for 1-mm …
deep (500-μm) and ultra-high aspect-ratio (UHAR) silicon structures (AR 40 for 1-mm …
Monolithic silicon‐micromachined free‐space optical interferometers onchip
The integration of microactuators within a silicon photonic chip gave rise to the field of
optical micro‐electro‐mechanical systems (MEMS) that was originally driven by the …
optical micro‐electro‐mechanical systems (MEMS) that was originally driven by the …
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask
The fabrication of a novel class of microgrippers is demonstrated by means of bulk
microelectromechanical systems (MEMS) technology using silicon on insulator wafer …
microelectromechanical systems (MEMS) technology using silicon on insulator wafer …
Biomedical nanobubbles and opportunities for microfluidics
The use of bulk nanobubbles in biomedicine is increasing in recent years, which is
attributable to the array of therapeutic and diagnostic tools promised by develo** bulk …
attributable to the array of therapeutic and diagnostic tools promised by develo** bulk …
[HTML][HTML] High aspect ratio arrays of Si nano-pillars using displacement Talbot lithography and gas-MacEtch
Structuring Si in arrays of vertical high aspect ratio pillars, ranging from nanoscale to
macroscale feature dimensions, is essential for producing functional interfaces for many …
macroscale feature dimensions, is essential for producing functional interfaces for many …