With the development of electronic technologies, electronic devices become smaller, while
their power density increases dramatically. The resulting excessive heat requires excellent …

Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

The thermal interface materials (TIMs) used for improving thermal contacts are considered in
terms of the performance, performance consideration criteria, performance evaluation …

This paper reviews carbon materials for significant emerging applications that relate to
structural self-sensing (a structural material sensing its own condition), electromagnetic …

Modern microelectronics and emerging technologies such as wearable devices and soft
robotics require conformable and thermally conductive thermal interface materials to …

Thermal interface materials (TIMs) are used extensively to improve thermal conduction
across two mating parts. They are particularly crucial in electronics thermal management …

In recent years, miniaturization and integration have become the development trends of
electronic devices. With the power of electronic devices continuing to increase, the amount …

Thermal contact resistance (TCR) plays an importance role in thermal management, which
can strongly affect heat dissipation across interfaces, especially as devices are becoming …

Using thermal interface materials (TIMs) is generally considered an effective way to reduce
thermal contact resistance. In this paper, effects of surface roughness, temperature and …

Thermal interface materials based on room temperature liquid metals (LMs) are promising
candidates for improving thermal management of flexible electronics, microelectronics …