The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

The reliability of an electronic product highly attributes to the fatigue failure of an
interconnected solder joint. The normal operating temperature for many electronic …

This article describes the measuring system and the influence of selected factors on the
accuracy of thermographic temperature measurement using a macrolens. This method …

Reliability risk in solder joints has been commonly linked to various failure mechanisms, with
electromigration (EM) and fatigue among the prominent drivers. Even though these failure …

The value of a semiconductor's diode temperature determines the correct operation of this
element and its useful lifetime. One of the methods for determining the die temperature of a …