An overview of hardware security and trust: Threats, countermeasures, and design tools

W Hu, CH Chang, A Sengupta, S Bhunia… - … on Computer-Aided …, 2020 - ieeexplore.ieee.org
Hardware security and trust have become a pressing issue during the last two decades due
to the globalization of the semiconductor supply chain and ubiquitous network connection of …

Securing Computer Hardware Using 3D Integrated Circuit ({{{{{IC}}}}}) Technology and Split Manufacturing for Obfuscation

F Imeson, A Emtenan, S Garg… - 22nd USENIX Security …, 2013 - usenix.org
The fabrication of digital Integrated Circuits (ICs) is increasingly outsourced. Given this trend,
security is recognized as an important issue. The threat agent is an attacker at the IC foundry …

Leveraging 3D technologies for hardware security: Opportunities and challenges

P Gu, S Li, D Stow, R Barnes, L Liu, Y **e… - Proceedings of the 26th …, 2016 - dl.acm.org
3D die stacking and 2.5 D interposer design are promising technologies to improve
integration density, performance and cost. Current approaches face serious issues in …

Invisimem: Smart memory defenses for memory bus side channel

S Aga, S Narayanasamy - ACM SIGARCH Computer Architecture News, 2017 - dl.acm.org
A practically feasible low-overhead hardware design that provides strong defenses against
memory bus side channel remains elusive. This paper observes that smart memory, memory …

Large-scale 3D chips: Challenges and solutions for design automation, testing, and trustworthy integration

J Knechtel, O Sinanoglu, IAM Elfadel… - IPSJ Transactions on …, 2017 - jstage.jst.go.jp
Three-dimensional (3D) integration of electronic chips has been advocated by both industry
and academia for many years. It is acknowledged as one of the most promising approaches …

Security and vulnerability implications of 3D ICs

Y **e, C Bao, C Serafy, T Lu… - … on Multi-Scale …, 2016 - ieeexplore.ieee.org
Physical limit of transistor miniaturization has driven chip design into the third dimension. 3D
integration technology emerges as a viable option to improve chip performance and …

A 3-D split manufacturing approach to trustworthy system development

J Valamehr, T Sherwood, R Kastner… - … on Computer-Aided …, 2013 - ieeexplore.ieee.org
Securing the supply chain of integrated circuits is of utmost importance to computer security.
In addition to counterfeit microelectronics, the theft or malicious modification of designs in …

On mitigation of side-channel attacks in 3D ICs: Decorrelating thermal patterns from power and activity

J Knechtel, O Sinanoglu - Proceedings of the 54th Annual Design …, 2017 - dl.acm.org
Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also
mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on …

An interposer-based root of trust: Seize the opportunity for secure system-level integration of untrusted chiplets

M Nabeel, M Ashraf, S Patnaik, V Soteriou… - arxiv preprint arxiv …, 2019 - arxiv.org
Leveraging 2.5 D interposer technology, we advocate the integration of untrusted commodity
components/chiplets with physically separate, entrusted logic components. Such …

Toleo: Scaling Freshness to Tera-scale Memory using CXL and PIM

J Dong, J Rosenblum, S Narayanasamy - arxiv preprint arxiv:2410.12749, 2024 - arxiv.org
Trusted hardware's freshness guarantee ensures that an adversary cannot replay an old
value in response to a memory read request. They rely on maintaining a version number for …