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Condition monitoring for device reliability in power electronic converters: A review
S Yang, D **juan-werner-anthony-ferraro-bruce-bomar-steve-hassett-bernard-mctaggart-bob-paulson-aziz-inan-william-roberts-william-tranter-leon-couch-michael-soderstrand-dave-jernigan-ravindranath-kollipara-melvin-belcher-barry-douglas-elvio-leonardo" data-clk="hl=vi&sa=T&ct=res&cd=5&d=4299240651457841406&ei=owHGZ56zAdaIieoP7cDcoAw" data-clk-atid="_kgQGpj4qTsJ" target="_blank">The electronics handbook
JC Whitaker, MH Kryder, JF Shackelford, VK Tripathi… - 2018 - taylorfrancis.com
During the ten years since the appearance of the groundbreaking, bestselling first edition of
The Electronics Handbook, the field has grown and changed tremendously. With a focus on …
The Electronics Handbook, the field has grown and changed tremendously. With a focus on …
Monitoring solder fatigue in a power module using case-above-ambient temperature rise
Condition monitoring is needed in power electronic systems as a cost-effective means of
improving reliability. Packaging-related solder fatigue has been identified as one of the main …
improving reliability. Packaging-related solder fatigue has been identified as one of the main …
Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration
JH Lau - … symposium on advanced packaging materials (APM), 2011 - ieeexplore.ieee.org
3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They
are different and in general the TSV (through-silicon via) separates 3D IC packaging from …
are different and in general the TSV (through-silicon via) separates 3D IC packaging from …
[SÁCH][B] Electronics manufacturing
Table of contents Chapter 1: Introduction to Environmentally Benign Electronics
Manufacturing Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps …
Manufacturing Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps …
Condition monitoring power module solder fatigue using inverter harmonic identification
Condition monitoring power semiconductor devices can inform converter maintenance and
reduce damage. This paper presents a method to monitor solder fatigue in a voltage source …
reduce damage. This paper presents a method to monitor solder fatigue in a voltage source …