HotSpot: A compact thermal modeling methodology for early-stage VLSI design
W Huang, S Ghosh, S Velusamy… - … Transactions on very …, 2006 - ieeexplore.ieee.org
This paper presents HotSpot-a modeling methodology for develo** compact thermal
models based on the popular stacked-layer packaging scheme in modern very large-scale …
models based on the popular stacked-layer packaging scheme in modern very large-scale …
Destination prediction by sub-trajectory synthesis and privacy protection against such prediction
Destination prediction is an essential task for many emerging location based applications
such as recommending sightseeing places and targeted advertising based on destination. A …
such as recommending sightseeing places and targeted advertising based on destination. A …
Thermal modeling, analysis, and management in VLSI circuits: Principles and methods
The growing packing density and power consumption of very large scale integration (VLSI)
circuits have made thermal effects one of the most important concerns of VLSI designers …
circuits have made thermal effects one of the most important concerns of VLSI designers …
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for
overcoming the barriers in interconnect scaling, offering an opportunity to continue the …
overcoming the barriers in interconnect scaling, offering an opportunity to continue the …
3D facial expression recognition based on primitive surface feature distribution
The creation of facial range models by 3D imaging systems has led to extensive work on 3D
face recognition [19]. However, little work has been done to study the usefulness of such …
face recognition [19]. However, little work has been done to study the usefulness of such …
Parameter variation tolerance and error resiliency: New design paradigm for the nanoscale era
Variations in process parameters affect the operation of integrated circuits (ICs) and pose a
significant threat to the continued scaling of transistor dimensions. Such parameter …
significant threat to the continued scaling of transistor dimensions. Such parameter …
3-D thermal-ADI: A linear-time chip level transient thermal simulator
TY Wang, CCP Chen - … on computer-aided design of integrated …, 2002 - ieeexplore.ieee.org
Recent study shows that the nonuniform thermal distribution not only has an impact on the
substrate but also interconnects. Hence, three-dimensional (3-D) thermal analysis is crucial …
substrate but also interconnects. Hence, three-dimensional (3-D) thermal analysis is crucial …
A survey of chip-level thermal simulators
Thermal modeling and simulation have become imperative in recent years owing to the
increased power density of high performance microprocessors. Temperature is a first-order …
increased power density of high performance microprocessors. Temperature is a first-order …
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly
impact the performance of global on-chip interconnects. This paper presents a detailed …
impact the performance of global on-chip interconnects. This paper presents a detailed …
Cell-level placement for improving substrate thermal distribution
CH Tsai, SM Kang - … Transactions on Computer-aided design of …, 2000 - ieeexplore.ieee.org
The dramatic increase of power consumption in very large scale integration circuits has led
to high operating temperature and large thermal gradient, thereby resulting in serious timing …
to high operating temperature and large thermal gradient, thereby resulting in serious timing …