This study investigated the fusion and phase-transformation processes of nano-intermetallic
compound (nano-IMC) mixed solder pastes. In particular, the interfacial reaction with the Cu …

Solid liquid interdiffusion (SLID) bonding that can fabricate high-melting point full IMC joints
is playing an increasing key role in 3rd-generation semiconductor power electronic device …

Thermoelectric modules fabricated by traditional welding fall short of achieving optimal
conversion efficiencies, primarily due to performance degradation of materials at high …

The growing demand for advanced materials for high-temperature connections has seen a
substantial increase in response to the greater integration and enhanced power of electronic …

Hybrid solder joints with upgraded functional performance and reliability were processed by
applying reactive Fe-nanoparticles doped into the flux at the interface in order to control and …

With the rapid development of the third-generation semiconductor power device towards
high density, high performance, miniaturization and high temperature resistance, it is now …

Electronic components of the spacecraft during their service may endure intricate and
extreme temperature environments. In this study, the interfacial microstructure evolution and …

Ni-xCu/Sn soldering joints were aged at 200° C, and the microstructure evolution and
mechanical properties during the solid-state reaction were studied under shear loading …

GeTe‐based materials exhibit superior thermoelectric performance, while the development
of power generation devices has mainly been limited by the challenge of designing the …

Fabricating high-quality bonding with a wide operating temperature range while minimizing
thermal damage to substrates during welding is critical for the reliability of circuit …