MEMS inductors are used in a wide range of applications in micro-and nanotechnology,
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

We report the fabrication of dense arrays of super-hydrophilic Cu microposts at solid
fractions as high as 58% and aspect ratios as high as four using electrochemical deposition …

Through-silicon vias (TSVs) have garnered a lot of interest in recent years because TSV is a
key enabling technology for three dimensional (3D) integrated circuit (IC) stacking, silicon …

Experimental investigation into the effect of tool electrode roughness on the geometric
characteristics of through-holes formed in glass substrate by electrochemical discharge …

As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

Recently, quaternary ammonium salt is considered as an effective leveler because of its
easy adsorption on the cathode surface. However, quaternary ammonium salt compounds …

Janus Green B (JGB) and Safranine T (ST) were used as levelers in the through-hole (TH)
copper electroplating experiments. Although JGB and ST have a similar part in the structure …

An organic additive, gentian violet (GVT), is explored for the first time as a novel leveler with
excellent property in through-holes (THs) metallization of Cu electronic plating in acidic …

Continuous demands to develop advanced radio-frequency transmission at higher
frequencies have initiated glass-based materials as a substrate in radio-frequency micro …