Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Polycrystalline optoelectronic materials are widely used for photoelectric signal conversion
and energy harvesting and play an irreplaceable role in the semiconductor field. As an …

Gallium nitride (GaN) is an important third-generation semiconductor material. However, due
to its high hardness, high brittleness and anisotropy, the material removal efficiency of GaN …

High entropy alloys (HEAs) are potential materials for coating due to their high hardness and
wear resistance. This study builds molecular dynamics models to explore the mechanical …

Abstract 4H-SiC wafer with alloy backside layer is gradually applied in power devices.
However, the laminated structure presents various challenges in manufacturing. In this …

As one of the most potentially lightweight and high-temperature structural materials, grain
size is a critical factor affecting the mechanical and cutting properties of γ-TiAl alloys during …

The scratching-induced material removal behavior and mechanism of single-crystal AlN
using single diamond abrasive were studied at atomic level through molecular dynamics …

The unique size effects of nanowires have inspired their implementation in superconducting
materials, micro/nano electromechanical systems, and flexible devices. Nanoskiving …

In nanocutting and nanopolishing of potassium dihydrogen phosphate (KDP) crystals,
microscopic abrasive particles scratch the material surfaces and cause subsurface damage …

With the rapid development of nano-polishing technology, ultra-precise micro-nano
components require tighter tolerances for the surface engineering of the Invar alloy. Due to …