Carbon materials, with their diverse allotropes, have played significant roles in our daily life
and the development of material science. Following 0D C60 and 1D carbon nanotube, 2D …

With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …

Miniaturized and high‐power‐density 3D electronic devices pose new challenges on
thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is …

The conventional fabrication of bulk van der Waals (vdW) materials requires a temperature
above 1,000° C to sinter from the corresponding particulates. Here we report the near-room …

Nanocomposites, multiphase solid materials with at least one nanoscaled component, have
been attracting ever‐increasing attention because of their unique properties. Graphene is an …

Abstract Three-dimensional (3D) graphene based wearable piezoresistive sensors are
considered as promising flexible sensors due to their facile preparation, simple read-out …

Since the first exfoliation in 2004, graphene has been widely researched in many fields of
materials engineering due to its highly appealing properties. Recently, graphene-based …

Thermal conductivity is critical to the stable operation, service life and reliability of electronic
equipment. Solving thermal management problems in electronic devices requires the …

Polymer‐based thermal interface materials (TIMs) with excellent thermal conductivity and
electrical resistivity are in high demand in the electronics industry. In the past decade …

Given the rapid developments in modern electronics, there is an urgent need for polymer
composites with excellent heat‐dissipating capabilities to address the cooling problem of …