Flip chip (FC) assembly technology was developed by IBM in 1960s and widely used in high
functional performances of electronic devices in computer, military, mobile, automobile etc …

A review about latest advances in packaging and drivers for the development of novel
packaging technologies will be given in this paper. Starting with a description about the …

The objective of this dissertation is to understand and control major reliability issues arising
from soldering reactions under space confinement in 3-D IC packages. The goal of current …

A method of etching a semiconductor structure, comprises contacting an under bump
metallization (UBM) with an etching composition. The UBM includes an underlying layer …

Wafer Level Packaging as Flip chip, Fan-in, 3D and TSV technologies are more and more
widely used in the semiconductor industry as it provides many benefits: die and package …

Рассмотрены и обобщены результаты исследований и разработок в области
формирования контактно-барьерных структур в изделиях субмикронной электроники и …

The operation of mounting chips into packages is the most critical in the technological
assembly of electronic products, pivotal for ensuring precise chip positioning, robust …

Purpose An investigation has been performed on the improved solder wettability of oxidized
aluminum (Al) with lead-free solder (96.5 Sn-3.5 Ag) using Ar-H2 plasmas. The lead-free …

One of the challenges in the fabrication of array transducers suitable for high-frequency
ultrasonic imaging is providing electrical connections between the array elements and …

This thesis presents the Simple Universal Parallel intERface (SuperCHIPS) protocol for high
interconnect density heterogeneous system integration. This is enabled by fine pitch …