Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Molecular dynamics (MD) simulations have become a pivotal tool in the nanofabrication of
semiconductor materials, a key area of contemporary semiconductor process research. This …

In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

The interplay between ductile and brittle deformation modes in hard brittle materials exhibits
a strong size effect. In the present work, indentation depth-dependent deformation …

In this paper, molecular dynamics simulations are carried out to investigate the cutting
mechanism during the hybrid machining process combined the thermal and vibration …

Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as
aviation, semiconductor, biomedicine, and other key fields due to their excellent material …

Elliptical vibration cutting (EVC) is a promising technique for improving the cutting
performance of single-crystal silicon. Whereas the material removal mechanism in the tool …

This work investigates the machining mechanism and deformation behavior of NiFeCo
under conventional nanoscale cutting and ultrasonic elliptical vibration-assisted cutting …

TiAl alloys are favored by the aerospace industry due to its excellent mechanical properties.
However, its intrinsic brittleness, the use of conventional cutting (CC) process leads to the …

This work investigates the wear behavior of nickel-based alloy during ultrasonic vibration-
assisted machining (UVAM) by combining molecular dynamics simulation and …