Polyurethane (PU) owing to its excellent efficiency are well-designed product and
extensively used in elastomers, coatings, foams, and adhesives. The use of natural and …

Thermal interface materials (TIMs) are one of the important components of materials used in
electronic packaging processes to reinforce the interface heat transfer between electronic …

A new kind of biobased material named lignin-containing polyhydroxyurethane (LPHU) is
prepared from bis (6-membered cyclic carbonate)(BCC), dimer fatty diamine, and lignin for …

Polymer composites with super-high thermal conductivity have attracted many interests in
aerospace and electrical fields. However, traditional polymer composites usually suffer from …

Thermal interface materials (TIMs) with excellent comprehensive performance which own
high thermal conductivity, good electrical insulation and mechanical properties have …

Epoxy resin (EP) possesses standout traits in adhesion, electrical insulation, as well as
mechanical properties, thus it is frequently concerned in the field of electronic packaging …

Polymeric composites with excellent thermal conductivity are in high demand in modern
electronics because of their need for efficient heat dissipation. Whereas, the thermally …

Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the
long-term stable operation of modern, high-performance electronic products. This study …

The fast growth of micro-flexible electronic devices has increased the amount of heat
generated and electronic waste, which has increased the demand for eco-friendly …

Recently, the use of fused deposition modeling (FDM) in the three-dimensional (3D) printing
of thermal interface materials (TIMs) has garnered increasing attention. Because fillers orient …