Finite element model (FEM) simulations have been performed to elucidate the effect of flat
plate photovoltaic (PV) module materials and design on PbSn eutectic solder joint thermal …

Solder joints between semiconductors and a printed circuit board may fail due to
temperature change or vibration. To assess the durability of solder joints a mechanical …

The exposure of miniaturized components to the environment leads to new failure analysis
as a result of environmental conditions and constant innovation of the component materials …

Purpose The purpose of this study was to investigate the changes in solder joint stress when
subjected to mechanical bending. The analytical theory pertaining to the stresses in the …

This study focused on the reliability testing of tantalum capacitors. The objective was to
develop efficient tests to examine the effects of temperature cycling on capacitor maximum …

Damage-based models for solder/intermetallics (IMC) interface often require the interface
properties such as tensile and shear strengths. The minute size of the solder joint renders …

A thorough understanding of the mechanics of lead-free solder joint in a ball grid array
(BGA) assembly under expected operating conditions is essential in develo** reliable life …

This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC)
interface fracture process using damage mechanics concept. The damage state, ϕ of a …

A probabilistic method is utilized to predict solder joint reliability of surface mounting
devices. Chip component 0603 is taken as an example. Based on the simplified joint …

In this study, cohesive damage zone model is evaluated and employed to model
solder/intermetallics (IMC) interface crack initiation and propagation in solder interconnects …